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Structural properties of silicon epitaxy grown at 200-600°C by electron-beam evaporation in an ultrahigh vacuum system

Author
TRI-RUNG YEW; YUNG-JEN LIN; MING-DENG SHIEH; CHENG-HSIEN CHEN
National Tsing-Hua univ., materials sci. cent., Hsinchu, Taiwan, Province of China
Source

Journal of applied physics. 1993, Vol 73, Num 10, pp 4932-4936 ; 1 ; ref : 7 ref

CODEN
JAPIAU
ISSN
0021-8979
Scientific domain
Crystallography; Electronics; Optics; Condensed state physics; Physics
Publisher
American Institute of Physics, Woodbury, NY
Publication country
United States
Document type
Article
Language
English
Keyword (fr)
Analyse chimique structurale Couche mince Croissance cristalline Epitaxie Etude expérimentale Evaporation faisceau électronique Interface solide solide MET Matériau semiconducteur Mode opératoire Nettoyage RHEED Silicium Ultravide Si Non métal
Keyword (en)
Structural chemical analysis Thin films Crystal growth Epitaxy Experimental study Electron beam evaporation Solid-solid interfaces TEM Semiconductor materials Operating mode Cleaning RHEED Silicon Ultrahigh vacuum Nonmetals
Keyword (es)
Método operatorio
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H55 Thin film structure and morphology / 001B60H55J Structure and morphology; thickness

Pacs
6855J Structure and morphology; thickness

Discipline
Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
3772910

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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