Effect of grain boundary phase on the thermal conductivity of aluminium nitride ceramics
- Author
- CHING-FONG CHEN1 ; PERISSE, M. E1 ; RAMIREZ, A. F1 ; PADTURE, N. P; CHAN, H. M
[1] Keramont Corp., Tucson AZ 85714, United States - Source
Journal of materials science. 1994, Vol 29, Num 6, pp 1595-1600 ; ref : 16 ref
- Publisher
- Springer, Heidelberg
- Publication country
- Germany
- Document type
- Article
- Language
- English
- Keyword (fr)
- Additif Aluminium nitrure Conductivité thermique Céramique sans oxyde Céramique électronique Etude expérimentale Fabrication Frittage Joint grain Microstructure Propriété thermique Relation fabrication propriété Yttrium oxyde Al N AlN O Y Y2O3
- Keyword (en)
- Additive Aluminium nitride Thermal conductivity Non oxide ceramics Electroceramics Experimental study Manufacturing Sintering Grain boundary Microstructure Thermal properties Fabrication property relation Yttrium oxide
- Keyword (es)
- Aditivo Aluminio nitruro Conductividad térmica Cerámica sin óxido Cerámica electrónica Estudio experimental Fabricación Sinterización Limite grano Microestructura Propiedad térmica Relación fabricación propiedad Ytrio óxido
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D08 Chemical industry and chemicals / 001D08B Building materials. Ceramics. Glasses / 001D08B04 Ceramic industries / 001D08B04C Technical ceramics / 001D08B04C2 Electrotechnical and electronic ceramics
- Discipline
- Chemical and parachemical industries
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 3968093
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1007/BF00368932 
https://dx.doi.org/10.1007/BF00368932
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