Thermally induced failure of copper-bonded alumina substrates for electronic packaging
- Author
- YOSHINO, Y; OHTSU, H; SHIBATA, T
Japan Steel Works Ltd, res. cent. advanced technologies, Yotsukaido Chiba Pref. 284, Japan - Source
Journal of the American Ceramic Society. 1992, Vol 75, Num 12, pp 3353-3357 ; ref : 14 ref
- CODEN
- JACTAW
- ISSN
- 0002-7820
- Scientific domain
- Chemical industry parachemical industry
- Publisher
- Blackwell, Malden,MA
- Publication country
- United States
- Document type
- Article
- Language
- English
- Keyword (fr)
- Alumine Cuivre Céramique oxyde Etude expérimentale Fissuration Matériau composite Packaging Plaque Propriété thermomécanique
- Keyword (en)
- Alumina Copper Oxide ceramics Experimental study Cracking Composite material Electronic packaging Plate Thermomechanical properties
- Keyword (es)
- Alúmina Cobre Cerámica óxido Estudio experimental Agrietamiento Material compuesto Packaging Placa Propriedad termomecánica
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D08 Chemical industry and chemicals / 001D08B Building materials. Ceramics. Glasses / 001D08B04 Ceramic industries / 001D08B04C Technical ceramics / 001D08B04C2 Electrotechnical and electronic ceramics
- Discipline
- Chemical and parachemical industries
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 4445745
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1111/j.1151-2916.1992.tb04433.x 
https://dx.doi.org/10.1111/j.1151-2916.1992.tb04433.x
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