«L'utilisation des adhésifs dans la réalisation des boîtiers hermétiques : exemples typiques de collage»
- Other title
- Gluing in the electronics industry the use of adhesives in the realisation of hermetic casings : typical example of gluing' (en)
- Author
- STRICOT, Y
Société BULL, div. packaging avancé circuits intégrés, 78340 Les Clayes-sous-Bois, France - Conference name
- «Le collage dans l'électronique». Journée technique (Paris)
- Source
Double liaison (1988). 1992, Vol 39, Num 440-42, pp 24-27, 8 p
- ISSN
- 1166-4398
- Scientific domain
- Polymers, paint and wood industries
- Publisher
- IDEXPO, L'Hay-les-Roses
- Publication country
- France
- Document type
- Conference Paper
- Language
- English; French
- Keyword (fr)
- Adhésif Boîtier Collage Céramique Electronique
- Keyword (en)
- Adhesive Package Adhesive bonding Ceramic materials Electronics
- Keyword (es)
- Adhesivo Estuche Enlace adhesivo Cerámica Electrónica
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers / 001D10A08 Application fields
- Discipline
- Polymer industry, paints, wood
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 4590194
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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