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Surface stress and interface formation

Author
TROMP, R. M
IBM, Thomas J. Watson res. cent., res. div., Yorktown Heights NY 10598, United States
Source

Physical review. B, Condensed matter. 1993, Vol 47, Num 12, pp 7125-7127 ; ref : 14 ref

CODEN
PRBMDO
ISSN
0163-1829
Scientific domain
Crystallography; Metallurgy, welding; Condensed state physics
Publisher
American Institute of Physics, Woodbury, NY / American Physical Society, Woodbury, NY
Publication country
United States
Document type
Article
Language
English
Keyword (fr)
Adsorption gaz solide Arsenic Contrainte Croissance cristalline Degré recouvrement Epitaxie Etude théorique Germanium Haute température Interface solide solide Migration atome Semiconducteur Silicium Surface Non métal
Keyword (en)
Gas solid adsorption Arsenic Constraint Crystal growth Coverage rate Epitaxy Theoretical study Germanium High temperature Solid solid interface Atom migration Semiconductor materials Silicon Surface Non metal
Keyword (es)
Adsorción gas sólido Arsénico Coacción Crecimiento cristalino Grado recubrimiento Epitaxia Estudio teórico Germanio Alta temperatura Interfase sólido sólido Migración átomo Semiconductor(material) Silicio Superficie No metal
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H35 Solid surfaces and solid-solid interfaces / 001B60H35B Surface structure and topography

Discipline
Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
4676753

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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