Abrasive machining of silicon
- Author
- TÖNSHOFF, H. K; SCHMIEDEN, W. V; INASAKI, I; KÖNIG, W; SPUR, G
- Source
CIRP annals. 1990, Vol 39, Num 2, pp 621-635 ; ref : 1 p.1/2
- ISSN
- 0007-8506
- Scientific domain
- Mechanical engineering; Metallurgy, welding
- Publisher
- Elsevier, Oxford
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Keyword (fr)
- Dispositif semiconducteur Fabrication Meulage Pastille électronique Silicium
- Keyword (en)
- Semiconductor device Manufacturing Grinding down Wafer Silicon
- Keyword (es)
- Dispositivo semiconductor Fabricación Amoladura Pastilla electrónica Silicio
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 5042244
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/S0007-8506(07)62999-0 
https://dx.doi.org/10.1016/S0007-8506(07)62999-0
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