Usinage ionique réactif de miroirs multicouches pour le domaine VUV-X en plasma fluorés
- Other title
- Ionic reactive etching of multilayer mirrors for VUV-X domain in fluorinated plasma (en)
- Author
- LADAN, F. R1 ; MALEK, C. K; RIVOIRA, R2 ; MORENO, T3
[1] CNRS, lab. microstructures microélectronique, 92220 Bagneux, France
[2] Univ. Aix-Marseille III, lab. physique intéractions photons-matière, 13397 Marseille, France
[3] Univ. Pierre Marie Curie, lab. chimie physique, 75231 Paris, France - Conference title
- 8e Colloque international sur les procédés plasma, 10-14 juin 1991, Antibes-Juan-Les-Pins, France
- Conference name
- CIP 91 [Colloque international sur les procédés plasma] (8 ; Antibes-Juan-les-Pins 1991-06-10)
- Author (monograph)
- Société française du vide. comité couches minces, matériaux et technologie pour l'électronique, France (Funder/Sponsor)
- Source
Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 298-300 ; SUP ; ref : 3 ref
- CODEN
- VCMIDS
- ISSN
- 0223-4335
- Scientific domain
- Metallurgy, welding; Physics
- Publisher
- Société française du vide, Paris
- Publication country
- France
- Document type
- Conference Paper
- Language
- French
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H35 Solid surfaces and solid-solid interfaces / 001B60H35B Surface structure and topography
- Discipline
- Physics of condensed state : structure, mechanical and thermal properties
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 5056432
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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