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Optimization of low pressure silicon nitride film growth from dichlorosilane and ammonia in integrated circuit manufacture

Author
PEEV, G; ZAMBOV, L
High inst. chemical technology, Sofia 1156, Bulgaria
Source

Thin solid films. 1991, Vol 203, Num 1, pp 185-193 ; ref : 24 ref

CODEN
THSFAP
ISSN
0040-6090
Scientific domain
Crystallography; Electronics; Metallurgy, welding; Condensed state physics
Publisher
Elsevier Science, Lausanne
Publication country
Switzerland
Document type
Article
Language
English
Keyword (fr)
Circuit intégré Composé minéral Couche mince Croissance cristalline Dépôt chimique phase vapeur Méthode optimisation Silicium Nitrure
Keyword (en)
Integrated circuit Inorganic compound Thin film Crystal growth Chemical vapor deposition Optimization method Silicon Nitrides
Keyword (es)
Circuito integrado Compuesto inorgánico Capa fina Crecimiento cristalino Depósito químico fase vapor Método optimización Silicio Nitruro
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H35 Solid surfaces and solid-solid interfaces / 001B60H35J Surface and interface dynamics and vibrations

Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H55 Thin film structure and morphology

Discipline
Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
5146600

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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