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Low-temperature furnace-grown reoxidized nitrided oxide gate dielectrics as a barrier to boron penetration

Author
FANG, H; KRISCH, K. S; GROSS, B. J; SODINI, C. G; CHUNG, J; ANTONIADIS, D. A
Massachusetts inst. technology, dep. electrical eng. computer sci., Cambridge MA 02139, United States
Source

IEEE electron device letters. 1992, Vol 13, Num 4, pp 217-219 ; ref : 15 ref

CODEN
EDLEDZ
ISSN
0741-3106
Scientific domain
Electronics
Publisher
Institute of Electrical and Electronics Engineers, New York, NY
Publication country
United States
Document type
Article
Language
English
Keyword (fr)
Bore Diffusion molécule Diélectrique Etude expérimentale Nitrure Oxyde Polycristal Porteur chaud Silicium Technologie MOS Température
Keyword (en)
Boron Molecule scattering Dielectric materials Experimental study Nitrides Oxides Polycrystal Hot carrier Silicon MOS technology Temperature
Keyword (es)
Boro Difusión molécula Dieléctrico Estudio experimental Nitruro Óxido Policristal Portador caliente Silicio Tecnología MOS Temperatura
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F02 Compound structure devices

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
5277112

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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