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Effect of Al2O3 additives on the formation of syperconducting whiskers (2212 phase) in melt-quenched BiSrCaCu2Ox

Author
ABE, Y1 ; HIRATA, K; HOSONO, H; KUBO, Y
[1] Nagoya inst. technology, dep. materials sci. eng., Showa-ku, Nagoya 466, Japan
Source

Journal of materials research. 1992, Vol 7, Num 7, pp 1599-1601 ; ref : 10 ref

CODEN
JMREEE
ISSN
0884-2914
Scientific domain
Metallurgy, welding; Condensed state physics
Publisher
Materials Research Society, Warrendale, PA
Publication country
United States
Document type
Article
Language
English
Keyword (fr)
Additif Bismuth Calcium Cuivre Strontium Oxyde Mixte Caractérisation Composé minéral Croissance cristalline Etude expérimentale Supraconducteur haute température Traitement thermique Trichite Métal transition Composé
Keyword (en)
Additive Bismuth Calcium Copper Strontium Oxides Mixed Characterization Inorganic compound Crystal growth Experimental study High temperature superconductor Heat treatment Whisker Transition metal Compounds
Keyword (es)
Aditivo Bismuto Calcio Cobre Estroncio Óxido Mixto Caracterización Compuesto inorgánico Crecimiento cristalino Estudio experimental Supraconductor alta temperatura Tratamiento térmico Triquito Metal transición Compuesto
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H70 Whiskers and dendrites (growth, structure, and nonelectronic properties)

Discipline
Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
5448651

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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