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Through-hole plating of Cu by modulated current deposition

Other title
Dépôt de cuivre dans des trous traversant utilisant un courant modulé (fr)
Author
HOLMBOM, G1 ; JACOBSSON, B. E
[1] Linköping inst. technology, Linköping, Sweden
Source

Surface & coatings technology. 1988, Vol 35, Num 3-4, pp 333-341 ; ref : 7 ref

CODEN
SCTEEJ
ISSN
0257-8972
Scientific domain
General chemistry, physical chemistry; Metallurgy, welding
Publisher
Elsevier, Lausanne
Publication country
Switzerland
Document type
Article
Language
English
Keyword (fr)
Circuit imprimé Courant pulse Cuivre Dépôt électrolytique Electronique Etat surface Etude expérimentale Trou Métal pur Cu
Keyword (en)
Printed circuit Pulsed current Copper Electroplating Electronics Surface conditions Experimental study Hole
Keyword (es)
Circuito imprimido Corriente pulsatoria Cobre Depósito electrolítico Electrónica Estado superficie Estudio experimental Hoyo
Keyword (de)
Gedruckte Schaltung Pulsierender Strom Kupfer Elektroplattieren Elektronik Oberflaechenzustand Experimentelle Untersuchung Loch
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A05 Specific materials / 001B80A05B Metals, semimetals and alloys

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11I Engineering techniques in metallurgy. Applications. Other aspects / 001D11I04 Applications

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11I Engineering techniques in metallurgy. Applications. Other aspects / 001D11I05 Others aspects

Discipline
Metals. Metallurgy Physics and materials science
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
7095284

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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