Surface-mount attachment reliability of clip-leaded ceramic chip carriers on FR-4 circuit boards
- Author
- ENGELMAIER, W1 ; ATTARWALA, A. I
[1] AT & T Bell Laboratories, Whippany NJ 07981, United States - Source
IEEE transactions on components, hybrids, and manufacturing technology. 1989, Vol 12, Num 2, pp 284-296 ; ref : 21 ref
- CODEN
- ITTEDR
- ISSN
- 0148-6411
- Scientific domain
- Electronics
- Publisher
- Institute of Electrical and Electronics Engineers, New York, NY
- Publication country
- United States
- Document type
- Article
- Language
- English
- Keyword (fr)
- Boîtier Circuit imprimé Circuit intégré Céramique Défaillance Equipement commercial Essai accéléré Fiabilité Interconnexion
- Keyword (en)
- Package Printed circuit Integrated circuit Ceramic materials Failures Commercial facility Accelerated test Reliability Interconnection
- Keyword (es)
- Estuche Circuito imprimido Circuito integrado Cerámica Fallo Equipamiento comercial Ensayo acelerado Fiabilidad Interconección
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03D Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 7309169
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1109/33.31435 
https://dx.doi.org/10.1109/33.31435
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