Thermal resistance at interfaces
- Author
- SWARTZ, E. T1 ; POHL, R. O
[1] Cornell univ., lab. atomic solid state physics, Ithaca NY 14853-2501, United States - Source
Applied physics letters. 1987, Vol 51, Num 26, pp 2200-2202 ; ref : 7 ref
- CODEN
- APPLAB
- ISSN
- 0003-6951
- Scientific domain
- Crystallography; Electronics; Optics; Condensed state physics
- Publisher
- American Institute of Physics, Melville, NY
- Publication country
- United States
- Document type
- Article
- Language
- English
- Keyword (fr)
- Application Circuit intégré Comportement thermique Couche mince Diffusion phonon Dissipation thermique Diélectrique Interface solide solide Métallisation Pulvérisation Résistance thermique Substrat Variation thermique
- Keyword (en)
- Application Integrated circuit Thermal behavior Thin film Phonon scattering Thermal dissipation Dielectric materials Solid solid interface Metallizing Spraying Thermal resistance Substrate Thermal variation
- Keyword (es)
- Aplicación Circuito integrado Comportamiento térmico Capa fina Difusión fonón Disipación térmica Dieléctrico Interfase sólido sólido Metalización Pulverización Resistencia térmica Substrato Variación térmica
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 7819212
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1063/1.98939 
https://dx.doi.org/10.1063/1.98939
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