Electroless nickel plating on alumina ceramics
- Other title
- Dépôt chimique de nickel sur des céramiques d'alumine (fr)
- Author
- HONMA, H1 ; KANEMITSU, K
[1] Kanto Gakuin univ., dep. chemical eng., Kanazawaku Yokohama 236, Japan - Source
Plating and surface finishing. 1987, Vol 74, Num 9, pp 62-67 ; ref : 3 ref
- CODEN
- PSFMDH
- ISSN
- 0360-3164
- Scientific domain
- Metallurgy, welding
- Publisher
- American Electroplaters and Surface Finishers Society, Orlando, FL
- Publication country
- United States
- Document type
- Article
- Language
- English
- Keyword (fr)
- Adhérence Aluminium oxyde Attaque micrographique Céramique Dépôt chimique Effet composition Nickel Préparation surface Métal pur Ni
- Keyword (en)
- Adhesion Aluminium oxide Etching Ceramic materials Electroless plating Composition effect Nickel Surface preparation
- Keyword (es)
- Adherencia Aluminio óxido Ataque micrográfico Cerámica Depósito químico Efecto composición Niquel Preparación superficie
- Keyword (de)
- Adhaesion Aluminiumoxid Aetzen Keramik Stromloses Beschichten Konzentrationseinfluss Nickel Oberflaechenvorbereitung
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A05 Specific materials / 001B80A05B Metals, semimetals and alloys
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11C Production techniques / 001D11C06 Surface treatment / 001D11C06D Metallic coatings
- Discipline
- Metals. Metallurgy Physics and materials science
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 8387027
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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