Study of interfacial reactions in ionized metal plasma (IMP) deposited al-0.5%wt Cu/Ti/SiO2/Si structure
- Author
- LEE, Y. K1 ; KHIN MAUNG LATT1 ; JAEHYUNG, Kim1 ; OSIPOWICZ, T2 ; CHIAM, Sher-Yi2 ; LEE, Kangsoo3
[1] Materials Engineering, School of Applied Science, Nanyang Technological University, Nanyang Avenue, Singapore 639798, Singapore
[2] Department of Physics, Lower Kent Ridge Road, Singapore 119260, Singapore
[3] Institute of Microelectronics, 11 Science Park Road, Singapore Science Park II, Singapore 117685, Singapore - Source
Journal of materials science. 2000, Vol 35, Num 23, pp 5857-5860 ; ref : 14 ref
- Publisher
- Springer, Heidelberg
- Publication country
- Germany
- Document type
- Article
- Language
- English
- Keyword (fr)
- Alliage base aluminium Application Circuit intégré Cuivre alliage Electronique Interconnexion Plasma Réaction interface Silice Silicium Température recuit Titane Al Cu Alliage Al99Cu1
- Keyword (en)
- Aluminium base alloys Application Integrated circuit Copper alloy Electronics Interconnection Plasma Interface reaction Silica Silicon Annealing temperature Titanium
- Keyword (es)
- Aplicación Circuito integrado Cobre aleación Electrónica Interconexión Plasma Reacción interfase Sílice Silicio Temperatura recocido Titanio
- Keyword (de)
- Anwendung Integrierte Schaltung Kupferlegierung Elektronik Plasma Silicium Gluehtemperatur Titan
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03C Materials
- Discipline
- Electronics Metals. Metallurgy
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 847212
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1023/A:1026756309590 
https://dx.doi.org/10.1023/A:1026756309590
"O:13:\"PanistOpenUrl\":36:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000idc\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:23:\"10.1023\/A:1026756309590\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:104:\"Study of interfacial reactions in ionized metal plasma (IMP) deposited al-0.5%wt Cu\/Ti\/SiO2\/Si structure\";s:9:\"\u0000*\u0000jtitle\";s:28:\"Journal of materials science\";s:9:\"\u0000*\u0000stitle\";s:13:\"J. mater. sci\";s:7:\"\u0000*\u0000date\";s:4:\"2000\";s:9:\"\u0000*\u0000volume\";s:2:\"35\";s:8:\"\u0000*\u0000issue\";s:2:\"23\";s:8:\"\u0000*\u0000spage\";s:4:\"5857\";s:8:\"\u0000*\u0000epage\";s:4:\"5860\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"0022-2461\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:3:\"LEE\";s:10:\"\u0000*\u0000aufirst\";s:4:\"Y. K\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:5:{i:0;s:15:\"KHIN MAUNG LATT\";i:1;s:13:\"JAEHYUNG, Kim\";i:2;s:12:\"OSIPOWICZ, T\";i:3;s:14:\"CHIAM, Sher-Yi\";i:4;s:12:\"LEE, Kangsoo\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:6:\"JMTSAS\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:104:\"Study of interfacial reactions in ionized metal plasma (IMP) deposited al-0.5%wt Cu\/Ti\/SiO2\/Si structure\";s:8:\"\u0000*\u0000place\";s:10:\"Heidelberg\";s:6:\"\u0000*\u0000pub\";s:8:\"Springer\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:0:\"\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Panist access
"O:12:\"IstexOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:23:\"10.1023\/A:1026756309590\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:104:\"Study of interfacial reactions in ionized metal plasma (IMP) deposited al-0.5%wt Cu\/Ti\/SiO2\/Si structure\";s:9:\"\u0000*\u0000jtitle\";s:28:\"Journal of materials science\";s:9:\"\u0000*\u0000stitle\";s:13:\"J. mater. sci\";s:7:\"\u0000*\u0000date\";s:4:\"2000\";s:9:\"\u0000*\u0000volume\";s:2:\"35\";s:8:\"\u0000*\u0000issue\";s:2:\"23\";s:8:\"\u0000*\u0000spage\";s:4:\"5857\";s:8:\"\u0000*\u0000epage\";s:4:\"5860\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"0022-2461\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:3:\"LEE\";s:10:\"\u0000*\u0000aufirst\";s:4:\"Y. K\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:5:{i:0;s:15:\"KHIN MAUNG LATT\";i:1;s:13:\"JAEHYUNG, Kim\";i:2;s:12:\"OSIPOWICZ, T\";i:3;s:14:\"CHIAM, Sher-Yi\";i:4;s:12:\"LEE, Kangsoo\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:6:\"JMTSAS\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:104:\"Study of interfacial reactions in ionized metal plasma (IMP) deposited al-0.5%wt Cu\/Ti\/SiO2\/Si structure\";s:8:\"\u0000*\u0000place\";s:10:\"Heidelberg\";s:6:\"\u0000*\u0000pub\";s:8:\"Springer\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:0:\"\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Istex access
"O:16:\"UnpaywallOpenUrl\":35:{s:8:\"\u0000*\u0000email\";s:27:\"assistance-portail@inist.fr\";s:6:\"\u0000*\u0000fmt\";N;s:6:\"\u0000*\u0000doi\";s:23:\"10.1023\/A:1026756309590\";s:6:\"\u0000*\u0000pii\";N;s:7:\"\u0000*\u0000pmid\";N;s:9:\"\u0000*\u0000atitle\";N;s:9:\"\u0000*\u0000jtitle\";N;s:9:\"\u0000*\u0000stitle\";N;s:7:\"\u0000*\u0000date\";N;s:9:\"\u0000*\u0000volume\";N;s:8:\"\u0000*\u0000issue\";N;s:8:\"\u0000*\u0000spage\";N;s:8:\"\u0000*\u0000epage\";N;s:8:\"\u0000*\u0000pages\";N;s:7:\"\u0000*\u0000issn\";N;s:8:\"\u0000*\u0000eissn\";N;s:9:\"\u0000*\u0000aulast\";N;s:10:\"\u0000*\u0000aufirst\";N;s:9:\"\u0000*\u0000auinit\";N;s:10:\"\u0000*\u0000auinitm\";N;s:5:\"\u0000*\u0000au\";N;s:9:\"\u0000*\u0000aucorp\";N;s:7:\"\u0000*\u0000isbn\";N;s:8:\"\u0000*\u0000coden\";N;s:8:\"\u0000*\u0000genre\";N;s:7:\"\u0000*\u0000part\";N;s:9:\"\u0000*\u0000btitle\";N;s:8:\"\u0000*\u0000title\";N;s:8:\"\u0000*\u0000place\";N;s:6:\"\u0000*\u0000pub\";N;s:10:\"\u0000*\u0000edition\";N;s:9:\"\u0000*\u0000tpages\";N;s:9:\"\u0000*\u0000series\";N;s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";N;}"
Unpaywall access
"O:16:\"EuropePMCOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:23:\"10.1023\/A:1026756309590\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:104:\"Study of interfacial reactions in ionized metal plasma (IMP) deposited al-0.5%wt Cu\/Ti\/SiO2\/Si structure\";s:9:\"\u0000*\u0000jtitle\";s:28:\"Journal of materials science\";s:9:\"\u0000*\u0000stitle\";s:13:\"J. mater. sci\";s:7:\"\u0000*\u0000date\";s:4:\"2000\";s:9:\"\u0000*\u0000volume\";s:2:\"35\";s:8:\"\u0000*\u0000issue\";s:2:\"23\";s:8:\"\u0000*\u0000spage\";s:4:\"5857\";s:8:\"\u0000*\u0000epage\";s:4:\"5860\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"0022-2461\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:3:\"LEE\";s:10:\"\u0000*\u0000aufirst\";s:4:\"Y. K\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:5:{i:0;s:15:\"KHIN MAUNG LATT\";i:1;s:13:\"JAEHYUNG, Kim\";i:2;s:12:\"OSIPOWICZ, T\";i:3;s:14:\"CHIAM, Sher-Yi\";i:4;s:12:\"LEE, Kangsoo\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:6:\"JMTSAS\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:104:\"Study of interfacial reactions in ionized metal plasma (IMP) deposited al-0.5%wt Cu\/Ti\/SiO2\/Si structure\";s:8:\"\u0000*\u0000place\";s:10:\"Heidelberg\";s:6:\"\u0000*\u0000pub\";s:8:\"Springer\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:0:\"\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Europe PubMed Central access
"O:12:\"ArXivOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:23:\"10.1023\/A:1026756309590\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:104:\"Study of interfacial reactions in ionized metal plasma (IMP) deposited al-0.5%wt Cu\/Ti\/SiO2\/Si structure\";s:9:\"\u0000*\u0000jtitle\";s:28:\"Journal of materials science\";s:9:\"\u0000*\u0000stitle\";s:13:\"J. mater. sci\";s:7:\"\u0000*\u0000date\";s:4:\"2000\";s:9:\"\u0000*\u0000volume\";s:2:\"35\";s:8:\"\u0000*\u0000issue\";s:2:\"23\";s:8:\"\u0000*\u0000spage\";s:4:\"5857\";s:8:\"\u0000*\u0000epage\";s:4:\"5860\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"0022-2461\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:3:\"LEE\";s:10:\"\u0000*\u0000aufirst\";s:4:\"Y. K\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:5:{i:0;s:15:\"KHIN MAUNG LATT\";i:1;s:13:\"JAEHYUNG, Kim\";i:2;s:12:\"OSIPOWICZ, T\";i:3;s:14:\"CHIAM, Sher-Yi\";i:4;s:12:\"LEE, Kangsoo\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:6:\"JMTSAS\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:104:\"Study of interfacial reactions in ionized metal plasma (IMP) deposited al-0.5%wt Cu\/Ti\/SiO2\/Si structure\";s:8:\"\u0000*\u0000place\";s:10:\"Heidelberg\";s:6:\"\u0000*\u0000pub\";s:8:\"Springer\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:0:\"\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
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