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The microstructure of thin aluminum-copper (4,5%) films deposited by sputtering techniques

Other title
Microstructures de couches minces aluminium-4,5% cuivre déposées par des techniques de pulvérisation (fr)
Author
CHI, G. C; NAKAHARA, S
AT & T Bell lab
Source

Materials letters (General ed.). 1984, Vol 2, Num 5A, pp 380-385 ; ref : 5 ref

CODEN
MLETDJ
ISSN
0167-577X
Scientific domain
Crystallography; Chemical industry parachemical industry; Condensed state physics; Polymers, paint and wood industries
Publisher
Elsevier, Amsterdam
Publication country
Netherlands
Document type
Article
Language
English
Keyword (fr)
Alliage binaire Alliage2 Al:>50 Cu:5-10 Alliage Attaque chimique Couche mince Etude expérimentale Microscopie électronique transmission Microscopie électronique Microstructure Métal transition Alliage Pulvérisation cathodique Support
Keyword (en)
Binary alloy Alloys Chemical etching Thin film Experimental study Transmission electron microscopy Electron microscopy Microstructure Transition metal Alloys Cathode sputtering Cathodic sputtering Substrate Support
Keyword (es)
Estudio experimental Microscopia electronica transmision
Keyword (de)
Legierung Chemisches Aetzen Duennschicht Experimentelle Untersuchung Elektronenmikroskopie Mikrogefuege Kathodenzerstaeubung Substrat
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H55 Thin film structure and morphology

Pascal
001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A05 Specific materials / 001B80A05B Metals, semimetals and alloys

Discipline
Physics and materials science Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
8972964

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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