An improved TMAH Si-etching solution without attacking exposed aluminum
- Author
- YAN, Guizhen1 ; CHAN, Philip C. H2 ; HSING, I-Ming3 ; SHARMA, Rajnish K2 ; SIN, Johnny K. O2 ; YANGYUAN WANG1
[1] Institute of Microelectronics, Peking University, Beijing, China
[2] Department of Electrical and Electronic Engineering, Hong Kong University of Science and Technology, Hong-Kong
[3] Department of Chemical Engineering, HKUST, Hong-Kong - Conference title
- Micromechanics Section of Sensors and Actuators. Technical digest
- Conference name
- IEEE International Workshop on Micro Electro Mechanical Systems (MEMS-2000) (MEMS-2000) (13 ; Miyazaki 2000-01-23)
- Author (monograph)
- IEEE, International (Funder/Sponsor)
- Source
Sensors and actuators. A, Physical. 2001, Vol 89, Num 1-2, pp 135-141 ; ref : 8 ref
- Publisher
- Elsevier Science, Lausanne
- Publication country
- Switzerland
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Aluminium Attaque chimique Dispositif micromécanique Dispositif électromécanique Etude expérimentale Procédé fabrication Silicium
- Keyword (en)
- Aluminium Chemical etching Micromechanical devices Electromechanical device Experimental study Manufacturing process Silicon
- Keyword (es)
- Aluminio Ataque químico Dispositivo electromecánico Estudio experimental Procedimiento fabricación Silicio
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D12 Mechanical engineering. Machine design / 001D12I Precision engineering, watch making
- Discipline
- Electronics Mechanical engineering. Mechanical construction. Handling
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 922028
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/S0924-4247(00)00546-X 
https://dx.doi.org/10.1016/S0924-4247(00)00546-X
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