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Feedback control of plasma etching reactors for improved etching uniformity

Author
ARMAOU, Antonios1 ; BAKER, James1 ; CHRISTOFIDES, Panagiotis D1
[1] Department of Chemical Engineering, University of California, Los Angeles, CA 90095, United States
Conference title
Chemical Reaction Engineering: Beyond the Year 2000. Part C
Conference name
ISCRE International Symposium on Chemical Reaction Engineering (16 ; Cracow 2000-09-10)
Author (monograph)
BURGHARDT, A (Editor)1 ; POHORECKI, R (Editor)2 ; CYBULSKI, A (Editor)3
[1] Polish Academy of Sciences, Institute of Chemical engineering, ul. Baltycka 5, 44-100 Gliwice, Poland
[2] Faculty of Chemical and Process Engineering, Warsaw University of Technology, ul. Warynskiego 1, 00-645 Warsaw, Poland
[3] CHEMIPAN, Institute of Physical Chemistry, Polish Academy of Sciences, ul. Kasprzaka 44/52, 01-224 Warsaw, Poland
Source

Chemical engineering science. 2001, Vol 56, Num 4, pp 1467-1475 ; ref : 20 ref

CODEN
CESCAC
ISSN
0009-2509
Scientific domain
Chemical engineering
Publisher
Elsevier, Oxford
Publication country
United Kingdom
Document type
Conference Paper
Language
English
Keyword (fr)
Boucle réaction Commande processus Commande répartie Couche mince Etat amorphe Fabrication microélectronique Gravure plasma Modèle 2 dimensions Modèle dynamique Modélisation Méthode numérique Pastille électronique Régulateur PI Silicium Système commande Non métal
Keyword (en)
Feedback Process control Distributed control Thin film Amorphous state Microelectronic fabrication Plasma etching Two dimensional model Dynamic model Modeling Numerical method Wafer Integral proportional regulator Silicon Control system Non metal
Keyword (es)
Retroalimentación Control proceso Control repartido Capa fina Estado amorfo Fabricación microeléctrica Grabado plasma Modelo 2 dimensiones Modelo dinámico Modelización Método numérico Pastilla electrónica Regulador PI Silicio Sistema control No metal
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B50 Physics of gases, plasmas and electric discharges / 001B50B Physics of plasmas and electric discharges / 001B50B77 Plasma applications

Pascal
001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A65 Surface treatments

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)

Pacs
8165C Surface cleaning, etching, patterning

Discipline
Electronics Physics and materials science Physics of gases, plasmas and electric discharges
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
927339

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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