THERMAL CHIP EVALUATION OF IC PACKAGING
- Author
- MCLAUGHLIN MH; FITZROY ND
GENERAL ELECTRIC CO., SCHENECTADY, N.Y. - Source
- I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1972; VOL. 8; NO 3; PP. 39-44; BIBL. 4 REF.
- Document type
- Serial Issue
- Language
- English
- Keyword (fr)
- ENCAPSULATION CIRCUIT INTEGRE TRANSFERT CHALEUR PASTILLE SEMICONDUCTRICE AGENCEMENT CIRCUIT SOUDURE CONNEXION ELECTRIQUE SUBSTRAT FABRICATION MICROELECTRONIQUE METHODE MESURE METHODE IMPULSIONNELLE METHODE COURANT CONTINU VISUALISATION CRISTAL LIQUIDE DETECTION RAYONNEMENT RAYONNEMENT INFRAROUGE TRANSISTOR ECHAUFFEMENT ELECTROMAGNETISME ELECTRONIQUE
- Keyword (en)
- ELECTROMAGNETISM ELECTRONICS
- Keyword (es)
- ELECTROMAGNETISMO ELECTRONICA
- Classification
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- PASCAL7314502901
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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