THERMAL CONSIDERATIONS IN THE DESIGN OF HYBRID MICROELECTRONIC PACKAGES
- Author
- BUCHANAN RC; REEBER MD
I.B.M., COMPONENTS DIV., HOPEWELL JUNCTION, N.Y. - Source
- SOLID STATE TECHNOL.; U.S.A.; DA. 1973; VOL. 16; NO 2; PP. 39-43; BIBL. 7 REF.
- Document type
- Serial Issue
- Language
- English
- Keyword (fr)
- CIRCUIT INTEGRE HYBRIDE ENCAPSULATION BOITIER TRANSFERT CHALEUR DISSIPATION THERMIQUE RESISTANCE THERMIQUE TECHNOLOGIE ELECTROMAGNETISME ELECTRONIQUE
- Keyword (en)
- ELECTROMAGNETISM ELECTRONICS
- Keyword (es)
- ELECTROMAGNETISMO ELECTRONICA
- Classification
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- PASCAL7314509024
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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