INTERDIFFUSION IN THE CU-AU THIN FILM SYSTEM AT 25OC TO 250OC.
- Author
- HALL PM; MORABITO JM; PANOUSIS NT
BELL TELEPHONE LAB. INC., ALLENTOWN, PA., U.S.A. - Source
- THIN SOLID FIBRUS; NETHERL.; DA. 1977; VOL. 41; NO 3; PP. 341-361; BIBL. 4 REF.
- Document type
- Article
- Language
- English
- Keyword (fr)
- AUTODIFFUSION ALLIAGE OR ALLIAGE CUIVRE ALLIAGE METAL TRANSITION COUCHE MINCE CONDUCTIVITE ELECTRIQUE EMISSION ELECTRONIQUE AUGER TEMPERATURE ALLIAGE CUIVRE OR DIFFUSION CUIVRE DIFFUSION OR DIFFUSION COUPLE DIFFUSION EFFET TEMPERATURE SPECTROMETRIE AUGER CUIVRE OR COMPOSITION CHIMIQUE PHYSIQUE SOLIDE METALLURGIE
- Keyword (en)
- SELF DIFFUSION THIN FILM ELECTRICAL CONDUCTIVITY AUGER EMISSION TEMPERATURE DIFFUSION DIFFUSION PAIR TEMPERATURE EFFECT AUGER ELECTRON SPECTROMETRY AUGER SPECTROSCOPY COPPER GOLD CHEMICAL COMPOSITION SOLID PHYSICS METALLURGY
- Keyword (es)
- FISICA DEL ESTADO CONDENSADO METALURGIA
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties
- Discipline
- Metals. Metallurgy Physics of condensed state : structure, mechanical and thermal properties
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- PASCAL7730430755
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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