CIRCUIT-BOARD PACKAGING CONSIDERATIONS FOR OPTIMUM UTILIZATION OF CHIP CARRIERS
- Author
- AMEY DI; BALDE JW
SPERRY UNIVAC'S GENERAL SYSTEMS DIVISION/BLUE BELL PA 19422/USA - Source
- I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 1; PP. 105-110; BIBL. 8 REF.
- Document type
- Article
- Language
- English
- Keyword (fr)
- CIRCUIT INTEGRE CIRCUIT LSI ENCAPSULATION COUT CIRCUIT INTEGRE HYBRIDE OPTIMISATION ELECTRONIQUE
- Keyword (en)
- INTEGRATED CIRCUIT LSI CIRCUIT COST HYBRID INTEGRATED CIRCUIT OPTIMIZATION ELECTRONICS
- Keyword (es)
- ELECTRONICA
- Classification
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- PASCAL8130011086
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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