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CIRCUIT-BOARD PACKAGING CONSIDERATIONS FOR OPTIMUM UTILIZATION OF CHIP CARRIERS

Author
AMEY DI; BALDE JW
SPERRY UNIVAC'S GENERAL SYSTEMS DIVISION/BLUE BELL PA 19422/USA
Source
I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 1; PP. 105-110; BIBL. 8 REF.
Document type
Article
Language
English
Keyword (fr)
CIRCUIT INTEGRE CIRCUIT LSI ENCAPSULATION COUT CIRCUIT INTEGRE HYBRIDE OPTIMISATION ELECTRONIQUE
Keyword (en)
INTEGRATED CIRCUIT LSI CIRCUIT COST HYBRID INTEGRATED CIRCUIT OPTIMIZATION ELECTRONICS
Keyword (es)
ELECTRONICA
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
PASCAL8130011086

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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