THERMAL CONDUCTION MODULE: A HIGH-PERFORMANCE MULTILAYER CERAMIC PACKAGE
- Author
- BLODGETT AJ; BARBOUR DR
I.B.M., THOMAS J. WATSON RES. CENT./YORKTOWN HEIGHTS NY 10598/USA - Source
- IBM J. RES. DEVELOP.; ISSN 0018-8646; USA; DA. 1982; VOL. 26; NO 1; PP. 30-36; BIBL. 9 REF.
- Document type
- Article
- Language
- English
- Keyword (fr)
- CIRCUIT INTEGRE CIRCUIT LSI FABRICATION CONCEPTION FIABILITE PERFORMANCE REFROIDISSEMENT CONDUCTION THERMIQUE CERAMIQUE UTILISATION ELECTRONIQUE TECHNOLOGIE TCM ELECTRONIQUE INDUSTRIE CHIMIQUE
- Keyword (en)
- INTEGRATED CIRCUIT MANUFACTURING DESIGN RELIABILITY PERFORMANCE COOLING THERMAL CONDUCTION CERAMIC MATERIALS USE ELECTRONICS ELECTRONICS CHEMICAL INDUSTRY
- Keyword (es)
- ELECTRONICA INDUSTRIA QUIMICA
- Classification
- Discipline
- Chemical engineering Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- PASCAL82X0163814
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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