DETERMINATION OF THE DEPTH OF PENETRATION IN THE SEALING OF INTEGRATED CIRCUIT PACKAGES BY MICROPLASMA WELDING
- Other title
- DETERMINATION DE LA PROFONDEUR DE PENETRATION LORS DE L'HERMETISATION PAR SOUDAGE AU MICROPLASMA DES BOITIERS DE CIRCUITS INTEGRES (fr)
- Author
- EFIMOV VM; ZUEV IV
- Source
- WELDG PRODUCT.; GBR; DA. 1977; VOL. 24; NO 10; PP. 37-39; BIBL. 6 REF.; DE RUS: SVAROCH. PROIZVOD., SUN, 1977, NO 10, 28-29; LOC. IS
- Document type
- Article
- Language
- English; Russian
- Keyword (fr)
- PROFONDEUR PENETRATION MICROASSEMBLAGE SOUDAGE PLASMA CIRCUIT INTEGRE CALCUL ELECTRONIQUE BOITIER APPLICATION PROCEDE UTILISE SOUDAGE AU MICROPLASMA SOUDAGE
- Keyword (en)
- PENETRATION DEPTH MICROASSEMBLING PLASMA WELDING INTEGRATED CIRCUIT ELECTRONICS PACKAGE APPLICATION WELDING
- Keyword (es)
- SOLDADURA
- Classification
- Discipline
- Metals. Metallurgy
- Origin
- Inist-CNRS ; IS
- Database
- PASCAL
- INIST identifier
- PASCALSOUDAGE7900095913
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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