INTERMETALLIC GROWTH DEPENDENCE ON SOLDER COMPOSITION IN THE SYSTEM CU-(PB-SN SOLDER)
- Other title
- CROISSANCE DE COMPOSES INTERMETALLIQUES EN FONCTION DE LA COMPOSITION DANS LA BRASURE DANS LE SYSTEME CU-BRASURE TENDRE SN-PB (fr)
- Author
- KUMAR K; MOSCARITOLO A; BROWNAWELL M
CHARLES STARK DRAPER LAB. INC./CAMBRIDGE MA 02139/USA - Source
- J. ELECTROCHEM. SOC.; ISSN 0013-4651; USA; DA. 1981; VOL. 128; NO 10; PP. 2165-2166; BIBL. 4 REF.
- Document type
- Article
- Language
- English
- Keyword (fr)
- CIRCUIT IMPRIME REVETEMENT METALLIQUE PRODUIT APPORT BRASAGE TENDRE COMPOSE INTERMETALLIQUE METAL PUR CU!SUB ALLIAGE2 SN:>50 PB:30-50!SEC SOUDAGE
- Keyword (en)
- PRINTED CIRCUIT METAL COATINGS SOLDER INTERMETALLIC COMPOUND WELDING
- Keyword (es)
- SOLDADURA
- Classification
- Discipline
- Metals. Metallurgy
- Origin
- Inist-CNRS ; IS
- Database
- PASCAL
- INIST identifier
- PASCALSOUDAGE8200141927
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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