Fluorescent spectra of tunable infrared laser crystals based on Cr³⁺ in oxides of high-valence cationsLUO ZUN-DU; CHEN CHIH-MING; CHEN DAO et al.Chinese physics. 1986, Vol 6, Num 4, pp 991-995, issn 0273-429XArticle

Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations : LOW TEMPERATURE PROCESSING FOR MICROELECTRONICS AND MICROSYSTEMS PACKAGINGLIN, Chi-Pu; CHEN, Chih-Ming.Microelectronics and reliability. 2012, Vol 52, Num 2, pp 385-390, issn 0026-2714, 6 p.Article

An Investigation into the Morphology and Electro-Optical Properties of 2-Hydroxy Ethyl Methacrylate Polymer Dispersed Liquid CrystalsCHANG, Huey-Ling; CHEN, Chih-Ming.Journal of applied polymer science (Print). 2010, Vol 118, Num 3, pp 1349-1355, issn 0021-8995, 7 p.Article

Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer BoardLIN, Chi-Pu; CHEN, Chih-Ming.Journal of electronic materials. 2009, Vol 38, Num 6, pp 908-914, issn 0361-5235, 7 p.Article

Mitigative Tin Whisker Growth Under Mechanically Applied Tensile StressCHEN, Yu-Jen; CHEN, Chih-Ming.Journal of electronic materials. 2009, Vol 38, Num 3, pp 415-419, issn 0361-5235, 5 p.Article

Effects of silver doping on electromigration of eutectic SnBi solderCHEN, Chih-Ming; HUANG, Chih-Chieh.Journal of alloys and compounds. 2008, Vol 461, Num 1-2, pp 235-241, issn 0925-8388, 7 p.Article

Electromigration of Sn-9wt.%Zn SolderHUNG, Yu-Min; CHEN, Chih-Ming.Journal of electronic materials. 2008, Vol 37, Num 6, pp 887-893, issn 0361-5235, 7 p.Article

Hierarchical Structure-Within-Structure Morphologies in A₂-star-(B-alt-C) MoleculesHUANG, Ching-I; CHEN, Chih-Ming.ChemPhysChem (Print). 2007, Vol 8, Num 18, pp 2588-2594, issn 1439-4235, 7 p.Article

Interfacial reactions and mechanical properties of ball-grid-array solder joints using Cu-cored solder ballsCHEN, Chih-Ming; LIN, Huei-Chuan.Journal of electronic materials. 2006, Vol 35, Num 11, pp 1937-1947, issn 0361-5235, 11 p.Conference Paper

Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow solderingWANG, Kai-Zheng; CHEN, Chih-Ming.Journal of electronic materials. 2005, Vol 34, Num 12, pp 1543-1549, issn 0361-5235, 7 p.Article

Electromigration in a Sn-3 wt.%Ag-0.5 wt.%Cu-3 wt.%Bi Solder Stripe Between Two Cu Electrodes Under Current StressingLEE, Shang-Hua; CHEN, Chih-Ming.Journal of electronic materials. 2011, Vol 40, Num 9, pp 1943-1949, issn 0361-5235, 7 p.Article

Soft computing approach to feature extractionCHUNSHIEN LI; HUANG, Jyh-Yann; CHEN, Chih-Ming et al.Fuzzy sets and systems. 2004, Vol 147, Num 1, pp 119-140, issn 0165-0114, 22 p.Article

The cross-interactions in the Ni/Sn/Cu diffusion couples with an electroless palladium surface finishLIN, Chi-Pu; CHEN, Chih-Ming.Journal of alloys and compounds. 2013, Vol 547, pp 37-42, issn 0925-8388, 6 p.Article

Using emotion recognition technology to assess the effects of different multimedia materials on learning emotion and performanceCHEN, Chih-Ming; WANG, Hui-Ping.Library & information science research. 2011, Vol 33, Num 3, pp 244-255, issn 0740-8188, 12 p.Article

Problem-based learning supported by digital archives Case study of Taiwan Libraries' History Digital LibraryCHEN, Chih-Ming; CHEN, Chia-Chi.Electronic library. 2010, Vol 28, Num 1, pp 5-28, issn 0264-0473, 24 p.Article

Interfacial reactions between eutectic SnZn solder and bulk or thin-film Cu substratesCHEN, Chih-Ming; CHEN, Chih-Hao.Journal of electronic materials. 2007, Vol 36, Num 10, pp 1363-1371, issn 0361-5235, 9 p.Article

Revisiting heat transfer analysis for rapid solidification of metal dropletsCHANG, Keh-Chin; CHEN, Chih-Ming.International journal of heat and mass transfer. 2001, Vol 44, Num 8, pp 1573-1583, issn 0017-9310Article

Effects upon interfacial reactions by electric currents of reversing directionsDU, Mei-Yau; CHEN, Chih-Ming; CHEN, Sinn-Wen et al.Materials chemistry and physics. 2003, Vol 82, Num 3, pp 818-825, issn 0254-0584, 8 p.Article

Synthesis of high loading and encapsulation efficient paclitaxel-loaded poly(n-butyl cyanoacrylate) nanoparticles via miniemulsionHUANG, Chi-Yu; CHEN, Chih-Ming; LEE, Yu-Der et al.International journal of pharmaceutics. 2007, Vol 338, Num 1-2, pp 267-275, issn 0378-5173, 9 p.Article

Interfacial Reaction of Molten Sn on a Strained Cu Electroplated LayerPAN, Hsiao-An; LIN, Chi-Pu; CHEN, Chih-Ming et al.Journal of electronic materials. 2012, Vol 41, Num 9, pp 2470-2477, issn 0361-5235, 8 p.Article

Interfacial Reactions of High-Bi Alloys on Various Substrates : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALSWANG, Jin-Yi; CHEN, Chih-Ming; YEN, Yee-Wen et al.Journal of electronic materials. 2014, Vol 43, Num 1, pp 155-165, issn 0361-5235, 11 p.Conference Paper

Interfacial Reactions in Sn-Co-(Cu)/Ni Couples With/Without Current StressingCHEN, Chih-Ming; HSU, Chia-Ming; CHEN, Sinn-Wen et al.Journal of electronic materials. 2012, Vol 41, Num 11, pp 3205-3214, issn 0361-5235, 10 p.Article

Electromigration of Sn-8 wt.% Zn-3 wt.% Bi and Sn-9 wt.% Zn-1 wt.% Cu soldersCHEN, Chih-Ming; HUNG, Yu-Min; LIN, Ching-Hsuan et al.Journal of alloys and compounds. 2009, Vol 475, Num 1-2, pp 238-244, issn 0925-8388, 7 p.Article

Electromigration-induced Bi segregation in eutectic SnBi solder jointCHEN, Chih-Ming; CHEN, Long-Tai; LIN, Ya-Shiu et al.Journal of electronic materials. 2007, Vol 36, Num 2, pp 168-172, issn 0361-5235, 5 p.Article

Isothermal solid-state aging of Pb-5Sn solder bump on Ni/Cu/Ti under bump metallizationCHEN, Chih-Ming; WANG, Kai-Jheng; CHEN, Ko-Chieh et al.Journal of alloys and compounds. 2007, Vol 432, Num 1-2, pp 122-128, issn 0925-8388, 7 p.Article