15th international workshop on THERMal INvestigations of ICs and systems (Leuven, Belgium, 7-9 October 2009)Courtois, Bernard.International workshop on THERMal INvestigations of ICs and Systems. 2009, isbn 978-2-35500-010-2, 1Vol, X-234 p, isbn 978-2-35500-010-2Conference Proceedings

TEST ET LSI = TEST AND LSICOURTOIS BERNARD.1981; ; FRA; DA. 1981; 457 P.; 30 CM; BIBL. 27 P.; TH.: SCI./GRENOBLE 1-INPG/1981Thesis

Special Issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2012COURTOIS, Bernard.Microsystem technologies. 2013, Vol 19, Num 6, issn 0946-7076, 184 p.Conference Proceedings

Special Issue on Design, Integration and Packaging of MEMS/MOEMS, 2010COURTOIS, Bernard.Microsystem technologies. 2011, Vol 17, Num 4, issn 0946-7076, 253 p.Conference Proceedings

Symposium on Design, Test, Integration, and packaging of MEMS/MOEMS, Stresa, Italy, 26-28 April 2006COURTOIS, Bernard.Microsystem technologies. 2007, Vol 13, Num 11-12, issn 0946-7076, 230 p.Conference Proceedings

Special Issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2009COURTOIS, Bernard.Microsystem technologies. 2010, Vol 16, Num 7, issn 0946-7076, 252 p.Conference Proceedings

THERMINIC WorkshopCOURTOIS, Bernard.IEEE transactions on very large scale integration (VLSI) systems. 1997, Vol 5, Num 3, pp 249-289, issn 1063-8210Conference Proceedings

Emulation-Based Transient Thermal Modeling of 2D/3D Systems-on-Chip with Active CoolingATIENZA, David.International workshop on THERMal INvestigations of ICs and Systems. 2009, pp 50-55, isbn 978-2-35500-010-2, 1Vol, 6 p.Conference Paper

Design, test, integration and packaging of MEMS/MOEMS 2006 (DTIP 2006)Courtois, Bernard.Symposium on Design, Test, Integration and Packaging of MWMS/MOEMS. 2006, isbn 2-916187-03-0, 1 vol (XIV-391 p.), isbn 2-916187-03-0Conference Proceedings

High-Level Thermal Profiling of Mobile ApplicationsMARCU, Marius.International workshop on THERMal INvestigations of ICs and Systems. 2009, pp 144-149, isbn 978-2-35500-010-2, 1Vol, 6 p.Conference Paper

Design, test, integration and packaging of MEMS/MOEMS 2004 (DTIP 2004)Courtois, Bernard.Symposium on Design, Test, Integration and Packaging of MWMS/MOEMS. 2004, isbn 2-84813-026-1, 1 vol (XV-490 p.), isbn 2-84813-026-1Conference Proceedings

17th international workshop on thermal investigations of ICs and systems (Therminic)Courtois, Bernard; Rencz, Marta.International workshop on THERMal INvestigations of ICs and Systems. 2011, isbn 978-2-355-00018-8, 1Vol, X-224 p, isbn 978-2-355-00018-8Conference Proceedings

Toward a Rational Modeling of ConvectionSABRY, M. N.International workshop on THERMal INvestigations of ICs and Systems. 2009, pp 2-7, isbn 978-2-35500-010-2, 1Vol, 6 p.Conference Paper

Les remparts de Brouage (Charente-Maritime): Territoires d'hivernage, de reproduction, d'alimentation et de repos du peuplement ophidien = Brouage fortification walls (Charente-Maritime): habitat for overwintering, breeding, feeding and resting of ophidiansCOURTOIS, Bernard; KIM, Alain.Annales de la Société des sciences naturelles de la Charente-Maritime. 2003, Vol 9, Num 3, pp 289-291, issn 0373-9929, 3 p.Article

Génération automatique de parties opératives de circuits VLSI de type microprocesseur = Automatic synthesis of data processing sections of VLSI microprocessor-like circuitsJAMIER, Robert; COURTOIS, Bernard.1986, 230 pThesis

Effects of simultaneous switching noise on the tapered buffer designVEMURU, S. R.IEEE transactions on very large scale integration (VLSI) systems. 1997, Vol 5, Num 3, pp 290-300, issn 1063-8210Conference Paper

Special Issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2011COURTOIS, Bernard; MICHEL, Bernd.Microsystem technologies. 2012, Vol 18, Num 11, issn 0946-7076, 185 p.Serial Issue

Design, Test, Integration and Packaging of MEMS/MOEMS, Stresa-Italy, 25-27 April 2007COURTOIS, Bernard; MICHEL, Bernd.Microsystem technologies. 2008, Vol 14, Num 7, issn 0946-7076, 896 p.Conference Proceedings

Rapport préliminaire sur les populations de vertébrés inféodés aux remparts de Brouage (Charente-Maritime) et aux terrains limitrophes = Preliminary report on vertebrate populations living in Brouage fortification walls and the surroundings (Charente-Maritime)KIM, Alain; COURTOIS, Bernard.Annales de la Société des sciences naturelles de la Charente-Maritime. 2003, Vol 9, Num 3, pp 293-296, issn 0373-9929, 4 p.Article

Simulation of maximum power in the wearable thermoelectric generator with a small thermopileLEONOV, Vladimir.Microsystem technologies. 2011, Vol 17, Num 4, pp 495-504, issn 0946-7076, 10 p.Conference Paper

Symposium on design, test, integration and packaging of MEMS/MOEMS, Montreux-Switzerland, 01-03 June 2005COURTOIS, Bernard; MICHEL, Bernd.Microsystem technologies. 2006, Vol 12, Num 10-11, issn 0946-7076, 193 p.Conference Proceedings

Characterisation of the etching quality in micro-electro-mechanical systems by thermal transient methodologySZABO, Peter; NEMETH, Balazs; RENCZ, Marta et al.Symposium on Design, Test, Integration and Packaging of MWMS/MOEMS. 2006, pp 322-327, isbn 2-916187-03-0, 6 p.Conference Paper

A full identification system for a tactile fingerprint sensorGALY, Nicolas; CHARIOT, Benoit; PARRAIN, Fabien et al.Symposium on Design, Test, Integration and Packaging of MWMS/MOEMS. 2004, pp 323-327, isbn 2-84813-026-1, 5 p.Conference Paper

Carbon Nanotube Enhanced Thermally Conductive Phase Change Material For Heat DissipationXINHE TANG; HAMMEL, Ernst; REITER, Werner et al.International workshop on THERMal INvestigations of ICs and Systems. 2009, pp 216-218, isbn 978-2-35500-010-2, 1Vol, 3 p.Conference Paper

Packaging of micromachined silicon microphonesDEHE, Alfons.Symposium on Design, Test, Integration and Packaging of MWMS/MOEMS. 2004, pp 19-23, isbn 2-84813-026-1, 5 p.Conference Paper