Electrically Conductive Adhesives. Part IIGOMATAM, Rajesh.Journal of adhesion science and technology. 2008, Vol 22, Num 14, issn 0169-4243, 203 p.Serial Issue

Electrically Conductive Adhesives, Part IGOMATAM, Rajesh R.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, issn 0169-4243, 221 p.Serial Issue

A novel cumulative fatigue damage model for electronically-conductive adhesive joints under variable loadingGOMATAM, Rajesh R; SANCAKTAR, Erol.Journal of adhesion science and technology. 2006, Vol 20, Num 1, pp 69-86, issn 0169-4243, 18 p.Article

Fatigue and failure behavior of silver-filled electronically-conductive adhesive joints subjected to elevated temperaturesGOMATAM, Rajesh R; SANCAKTAR, Erol.Journal of adhesion science and technology. 2004, Vol 18, Num 8, pp 849-881, issn 0169-4243, 33 p.Article

The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part I: the effects of adhesive thicknessGOMATAM, Rajesh R; SANCAKTAR, Erol.Journal of adhesion science and technology. 2004, Vol 18, Num 11, pp 1225-1243, issn 0169-4243, 19 p.Article

The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part II: the effects of bonding pressureGOMATAM, Rajesh R; SANCAKTAR, Erol.Journal of adhesion science and technology. 2004, Vol 18, Num 11, pp 1245-1261, issn 0169-4243, 17 p.Article

A study on the effects of surface roughness on the strength of single lap jointsSANCAKTAR, Erol; GOMATAM, Rajesh.Journal of adhesion science and technology. 2001, Vol 15, Num 1, pp 97-117, issn 0169-4243Article

Novel Techniques for Characterization of Fast-Cure Anisotropic Conductive and Non-conductive AdhesivesTEO, Mary.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, pp 1003-1015, issn 0169-4243, 13 p.Article

A comprehensive fatigue life predictive model for electronically conductive adhesive joints under constant-cycle loadingGOMATAM, Rajesh R; SANCAKTAR, Erol.Journal of adhesion science and technology. 2006, Vol 20, Num 1, pp 87-104, issn 0169-4243, 18 p.Article

Operating Temperature of Anisotropic Conducting Film AdhesivesDIVIGALPITIYA, Ranjith.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, pp 915-926, issn 0169-4243, 12 p.Article

The effects of stress state, loading frequency and cyclic waveforms on the fatigue behavior of silver-filled electronically-conductive adhesive jointsGOMATAM, Rajesh R; SANCAKTAR, Erol.Journal of adhesion science and technology. 2006, Vol 20, Num 1, pp 53-68, issn 0169-4243, 16 p.Article

Effects of various adherend surface treatments on fatigue behavior of joints bonded with a silver-filled electronically conductive adhesiveGOMATAM, Rajesh R; SANCAKTAR, Erol.Journal of adhesion science and technology. 2005, Vol 19, Num 8, pp 659-678, issn 0169-4243, 20 p.Article

Dynamic fatigue and failure behavior of silver-filled electronically conductive adhesive joints at ambient environmental conditionsGOMATAM, Rajesh R; SANCAKTAR, Erol.Journal of adhesion science and technology. 2004, Vol 18, Num 7, pp 731-750, issn 0169-4243, 20 p.Article

Fatigue and failure behaviors of silver-filled electronically-conductive adhesive joints subjected to elevated humidityGOMATAM, Rajesh R; SANCAKTAR, Erol.Journal of adhesion science and technology. 2004, Vol 18, Num 15-16, pp 1833-1848, issn 0169-4243, 16 p.Article

Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper ParticlesLIN, Yung-Sen; CHIU, Sheng-Shiang.Journal of adhesion science and technology. 2008, Vol 22, Num 14, pp 1673-1697, issn 0169-4243, 25 p.Article

A novel mathematical procedure to evaluate the effects of surface topography on the interfacial state of stress. Part II. Verification of the method for scarf interfacesWEIJIAN MA; GOMATAM, Rajesh; SANCAKTAR, Erol et al.Journal of adhesion science and technology. 2003, Vol 17, Num 6, pp 831-846, issn 0169-4243, 16 p.Article

Using Electrically Conductive Inks and Adhesives as a Means to Satisfy European PCB Manufacturing DirectivesLEWIS, H. J; RYAN, A.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, pp 893-913, issn 0169-4243, 21 p.Article

Stable and Unstable Capillary Flows of Highly-Filled Epoxy/Nickel SuspensionsJIANGUO ZHOU; SANCAKTAR, Erol.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, pp 983-1002, issn 0169-4243, 20 p.Article

Modeling fatigue behavior of electronically conductive filled adhesive joints under cyclic loading: A novel modeling approach for integrated joint life predictionGOMATAM, Rajesh R; SANCAKTAR, Erol.SPIE proceedings series. 2003, pp 745-750, isbn 0-8194-5189-4, 6 p.Conference Paper

Modeling fatigue behavior of electronically conductive adhesive joints under elevated temperature and humidity conditionsGOMATAM, Rajesh R; SANCAKTAR, Erol.IEEE international conference on polymers and adhesives in microelectronics and photonics. 2004, pp 14-26, isbn 0-7803-8744-9, 1Vol, 13 p.Conference Paper

Chemorheology of Epoxy/Nickel Conductive Adhesives During Processing and CureJIANGUO ZHOU; SANCAKTAR, Erol.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, pp 957-981, issn 0169-4243, 25 p.Article

Numerical simulation of underfill cure evolution in chip-scale-package (CSP) manufacturing processGOMATAM, Rajesh R; COULTER, John P.SPIE proceedings series. 2003, pp 916-921, isbn 0-8194-5189-4, 6 p.Conference Paper

Geometric Effects on Multilayer Generic Circuits Fabricated Using Conductive Epoxy/Nickel AdhesivesJIANGUO ZHOU; SANCAKTAR, Erol.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, pp 947-956, issn 0169-4243, 10 p.Article

Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging ApplicationsLIN, Y. C; CHEN, X.Journal of adhesion science and technology. 2008, Vol 22, Num 14, pp 1631-1657, issn 0169-4243, 27 p.Article

Fatigue Behavior of Electrically Conductive AdhesivesBIN SU; JIANMIN QU.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, pp 927-946, issn 0169-4243, 20 p.Article