Optimal Ni(P) thickness design in ultrathin-ENEPIG metallization for soldering application concerning electrical impedance and mechanical bonding strengthHO, Cheng-Ying; DUH, Jenq-Gong.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2014, Vol 611, pp 162-169, issn 0921-5093, 8 p.Article

Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assembliesHO, Cheng-Ying; TSAI, Meng-Ting; DUH, Jenq-Gong et al.Journal of alloys and compounds. 2014, Vol 600, pp 199-203, issn 0925-8388, 5 p.Article

Crystallographic characterization and growth behavior of (Cu,Ni,Pd)₆Sn₅ intermetallic compound in Ni(P)/Pd/Au/SnAgCu/Cu assembled solder jointTSENG, Chien-Fu; HO, Cheng-Ying; LEE, Joseph et al.Journal of alloys and compounds. 2014, Vol 600, pp 21-28, issn 0925-8388, 8 p.Article

Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn-Ag-Cu solder jointsCHEN, Wen-Lin; YU, Chi-Yang; HO, Cheng-Ying et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2014, Vol 613, pp 193-200, issn 0921-5093, 8 p.Article

Effect of Diallyl Sulfide on in Vitro and in Vivo Nrf2-Mediated Pulmonic Antioxidant Enzyme Expression via Activation ERK/p38 Signaling PathwayHO, Cheng-Ying; CHENG, Yu-Ting; CHAU, Chi-Fai et al.Journal of agricultural and food chemistry (Print). 2012, Vol 60, Num 1, pp 100-107, issn 0021-8561, 8 p.Article

Diallyl sulfide as a potential dietary agent to reduce TNF-α- and histamine-induced proinflammatory responses in A7r5 cellsHO, Cheng-Ying; WENG, Chia-Jui; JHANG, Jhih-Jia et al.Molecular nutrition & food research (Print). 2014, Vol 58, Num 5, pp 1069-1078, issn 1613-4125, 10 p.Article

Gigahertz Coherent Guided Acoustic Phonons in AlN/GaN Nanowire SuperlatticesMANTE, Pierre-Adrien; WU, Yueh-Chun; LIN, Yuan-Ting et al.Nano letters (Print). 2013, Vol 13, Num 3, pp 1139-1144, issn 1530-6984, 6 p.Article