Bending and twisting of cylindrical solder interconnections with creepLAU, John H.Soldering & surface mount technology. 2001, Vol 13, Num 2, pp 14-20, issn 0954-0911Article

Bayesian semi-parametric modeling for mixed proportional hazard models with right censoringLAU, John W.Statistics & probability letters. 2006, Vol 76, Num 7, pp 719-728, issn 0167-7152, 10 p.Article

Critical issues of wafer level chip scale package (WLCSP) with emphasis on cost analysis and solder joint reliabilityLAU, John H.IEEE transactions on electronics packaging manufacturing. 2002, Vol 25, Num 1, pp 42-50, issn 1521-334XArticle

Critical Issues of TSV and 3D IC IntegrationLAU, John H.Journal of microelectronics and electronic packaging. 2010, Vol 7, Num 1, pp 35-43, issn 1551-4897, 9 p.Article

Overview and outlook of through-silicon via (TSV) and 3D integrationsLAU, John H.Microelectronics international. 2011, Vol 28, Num 2, pp 8-22, issn 1356-5362, 15 p.Article

Design and Process of 3D MEMS System-in-Package (SiP)LAU, John H.Journal of microelectronics and electronic packaging. 2010, Vol 7, Num 1, pp 10-15, issn 1551-4897, 6 p.Article

Reliability testing and data analysis of an 1657CCGA (Ceramic Column Grid Array) package with lead-free solder paste on lead-free PCBs (Printed Circuit Boards)LAU, John; DAUKSHER, Walter; OTT, Ed et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 1, 718-725Conference Paper

Impact of Packaging Design on Reliability of Large Die Cu/low-κ (BD) InterconnectTAI CHONG CHAI; XIAOWU ZHANG; DONGZHI CHI et al.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2012, Vol 2, Num 5-6, pp 807-816, issn 2156-3950, 10 p.Article

Effects of voids on bump chip carrier (BCC++) solder joint reliabilityLAU, John; ERASMUS, Steve; PAN, Stephen et al.Proceedings - Electronic Components Conference. 2002, pp 992-1000, issn 0569-5503, isbn 0-7803-7430-4, 9 p.Conference Paper

Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) PackageLAU, John; CASTELLO, Todd; SHANGGUAN, Dongkai et al.Journal of microelectronics and electronic packaging. 2007, Vol 4, Num 3, pp 112-120, issn 1551-4897, 9 p.Article

Multidetector CT enteroclysis localized a Meckel's diverticulum in a case of obscure GI bleeding. CommentaryKALTENBACH, Tonya; NGUYEN, Chanh; LAU, John et al.Gastrointestinal endoscopy. 2006, Vol 64, Num 3, pp 441-442, issn 0016-5107, 2 p.Article

Design, materials, and assembly process of high-density packages with a low-temperature lead-free solder (SnBiAg)LAU, John; GLEASON, Jerry; SCHROEDER, Valeska et al.Soldering & surface mount technology. 2008, Vol 20, Num 2, pp 11-20, issn 0954-0911, 10 p.Article

Failure analysis of lead-free solder joints for high-density packagesLAU, John; SHANGGUAN, Dongkai; CASTELLO, Todd et al.Soldering & surface mount technology. 2004, Vol 16, Num 2, pp 3-4, issn 0954-0911, 2 p., 6, 8, 69-76 [12 p.]Article

Characteristics and reliability of fast-flow, snap-cure, and reworkable underfills for solder bumped flip chip on low-cost substratesLAU, John H; CHANG, Chris.IEEE transactions on electronics packaging manufacturing. 2002, Vol 25, Num 3, pp 231-239, issn 1521-334X, 9 p.Article

3D LED and IC wafer level packagingLAU, John; LEE, Ricky; YUEN, Matthew et al.Microelectronics international. 2010, Vol 27, Num 2, pp 98-105, issn 1356-5362, 8 p.Article

A Pluggable Large Core Step Index Plastic Optical Fiber With Built-In Mode Conditioners for Gigabit Ultra Short Reach NetworksCHANDRAPPAN, Jayakrishnan; ZHANG JING; NG RUI JIE et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 4, pp 868-875, issn 1521-3323, 8 p.Article

Reliability test and failure analysis of high-density packages assembled with a low-temperature lead-free solder (SnBiAg)LAU, John; GLEASON, Jerry; SCHROEDER, Valeska et al.Soldering & surface mount technology. 2008, Vol 20, Num 2, pp 21-29, issn 0954-0911, 9 p.Article

Design for lead-free solder joint reliability of high-density packagesLAU, John; DAUKSHER, Walter; SMETANA, Joe et al.Soldering & surface mount technology. 2004, Vol 16, Num 1, pp 12-26, issn 0954-0911, 15 p.Article

Design, materials and process for lead-free assembly of high-density packagesSMETANA, Joe; HORSLEY, Rob; LAU, John et al.Soldering & surface mount technology. 2004, Vol 16, Num 1, pp 53-62, issn 0954-0911, 10 p.Article

Reliability testing and data analysis of lead-free solder joints for high-density packagesLAU, John; HOO, Nick; HORSLEY, Rob et al.Soldering & surface mount technology. 2004, Vol 16, Num 2, issn 0954-0911, 3, 5-6, 7-8, 46-68 [28 p.]Article

The effects of HDV-insulin on carbohydrate metabolism in Type 1 diabetic patientsDAVIS, Stephen N; GEHO, Blair; TATE, Donna et al.Journal of diabetes and its complications. 2001, Vol 15, Num 5, pp 227-233, issn 1056-8727Article

Creep behaviors of Flip Chip on Board with 96.5Sn-3.5Ag and 100in lead-free solder jointsLAU, John H; PAN, Stephen H.The International journal of microcircuits and electronic packaging. 2001, Vol 24, Num 1, pp 11-18, issn 1063-1674Article

Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP)LAU, John H; TANG GONG YUE.Microelectronics and reliability. 2012, Vol 52, Num 11, pp 2660-2669, issn 0026-2714, 10 p.Article

Computational analysis on the effects of double-layer build-up printed circuit board on the wafer level chip scale package (WLCSP) assembly with Pb-free solder jointsLAU, John H; LEE, S.-W. Ricky.The International journal of microcircuits and electronic packaging. 2001, Vol 24, Num 2, pp 89-104, issn 1063-1674Article

Bayesian mixture of autoregressive modelsLAU, John W; SO, Mike K. P.Computational statistics & data analysis. 2008, Vol 53, Num 1, pp 38-60, issn 0167-9473, 23 p.Article