au.\*:("SADAKATA, Nobuyuki")
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A wafer-level chip scale package build up with a metal-covered polyimide postSADAKATA, Nobuyuki; SUZUKI, Takanao; INABA, Masatoshi M et al.SPIE proceedings series. 2000, pp 123-127, isbn 0-930815-60-2Conference Paper
Effect of void formation on thermal fatigue reliability of lead-free solder jointsKIM, Do-Seop; YU, Qiang; SHIBUTANI, Tadahiro et al.InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 2004, isbn 0-7803-8357-5, Vol2, 325-329Conference Paper
Development of a CuNb reinforced and stabilized Nb3Sn coil for a cryocooled superconducting magnet systemGOTO, Kenji; IWASAKI, Shoji; SADAKATA, Nobuyuki et al.IEEE transactions on applied superconductivity. 2001, Vol 11, Num 1, pp 3623-3626, issn 1051-8223, 3Conference Paper