Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environmentsSUBRAMANIAN, K. N.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, pp 237-246, issn 0957-4522, 10 p.Article

A parametric approach for assessment of thermomechanical fatigue performance of Sn-based solder jointsSUBRAMANIAN, K. N.Journal of electronic materials. 2005, Vol 34, Num 10, pp 1313-1317, issn 0361-5235, 5 p.Article

Lead-free electronic soldersSUBRAMANIAN, K. N.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, issn 0957-4522, 366 p.Serial Issue

Deformation structure in LiF single crystalsSUBRAMANIAN, K. N.Physica status solidi. A. Applied research. 1983, Vol 77, Num 1, pp 361-367, issn 0031-8965Article

Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursionsSUBRAMANIAN, K. N.Fatigue & fracture of engineering materials & structures (Print). 2007, Vol 30, Num 5, pp 420-431, issn 8756-758X, 12 p.Article

Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of pre-strained eutectic Sn-3.5Ag solder jointsRHEE, H; SUBRAMANIAN, K. N.Soldering & surface mount technology. 2006, Vol 18, Num 1, pp 19-28, issn 0954-0911, 10 p.Article

Development of nano-composite lead-free electronic soldersLEE, Andre; SUBRAMANIAN, K. N.Journal of electronic materials. 2005, Vol 34, Num 11, pp 1399-1407, issn 0361-5235, 9 p.Article

Critical studies to improve service reliability of Sn―Ag―Cu solder joints by thermal treatmentsBERGMAN, Stephanie; SUBRAMANIAN, K. N.Journal of materials science. Materials in electronics. 2012, Vol 23, Num 7, pp 1442-1448, issn 0957-4522, 7 p.Article

The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder jointsSWENSON, D.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, pp 39-54, issn 0957-4522, 16 p.Article

Composite lead-free electronic soldersFU GUO.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, pp 129-145, issn 0957-4522, 17 p.Article

Isolation of low molecular weight DNA from bacteria and animal cellsANANT, S; SUBRAMANIAN, K. N.Methods in enzymology. 1992, Vol 216, pp 20-29, issn 0076-6879Article

Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applicationsANDERSON, Iver E.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, pp 55-76, issn 0957-4522, 22 p.Article

Sn-Zn low temperature solderSUGANUMA, Katsuaki; KIM, Kuen-Soo.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, pp 121-127, issn 0957-4522, 7 p.Article

The effect of thermal cycling on interfacial bonding in a ceramic matrix composite reinforced with a metallic ribbonLEE, T. K; SUBRAMANIAN, K. N.Scripta metallurgica et materialia. 1993, Vol 28, Num 11, pp 1405-1410, issn 0956-716XArticle

Efficient replication of plasmids containing the SV40 origin in N-myc overexpressing human neuroblastoma cellsNA-GYONG LEE; YAMAGUCHI, J; SUBRAMANIAN, K. N et al.Oncogene : (Basingstoke). 1991, Vol 6, Num 7, pp 1161-1169Article

Effects of position and orientation of the 72-base-pair-repeat transcriptional enhancer on replication from the simian virus 40 core originCHANDRASEKHARAPPA, S. C; SUBRAMANIAN, K. N.Journal of virology. 1987, Vol 61, Num 10, pp 2973-2980, issn 0022-538XArticle

Minimal transcriptional enhancer of simian virus 40 is a 74-base-pair sequence that has interacting domainsFIRAK, T. A; SUBRAMANIAN, K. N.Molecular and cellular biology (Print). 1986, Vol 6, Num 11, pp 3667-3676, issn 0270-7306Article

Strength and fracture of amorphous and partially crystallized seleniumDAUDI, A. R; SUBRAMANIAN, K. N.Journal of materials science. 1983, Vol 18, Num 8, pp 2393-2400, issn 0022-2461Article

Microstructure-based modeling of deformation in sn-rich (Pb-free) solder alloysCHAWLA, N; SIDHU, R. S.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, pp 175-189, issn 0957-4522, 15 p.Article

Electromigration issues in lead-free solder jointsCHEN, Chih; LIANG, S. W.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, pp 259-268, issn 0957-4522, 10 p.Article

Microstructural features contributing to enhanced behaviour of Sn-Ag based solder jointsLEE, J. G; SUBRAMANIAN, K. N.Soldering & surface mount technology. 2005, Vol 17, Num 1, pp 33-39, issn 0954-0911, 7 p.Article

Creep behaviour of composite lead-free electronic solder jointsGUO, F; LEE, J; SUBRAMANIAN, K. N et al.Soldering & surface mount technology. 2003, Vol 15, Num 1, pp 39-42, issn 0954-0911, 4 p.Article

Discontinous metallic-glass ribbon reinforced glass-ceramic matrix compositesVAIDYA, R. U; SUBRAMANIAN, K. N.Journal of materials science. 1991, Vol 26, Num 23, pp 6453-6457, issn 0022-2461Article

Stress transfer in a metallic-glass ribbon-reinforced epoxy matrix compositeVAIDYA, R. U; SUBRAMANIAN, K. N.Journal of materials science letters. 1990, Vol 9, Num 12, pp 1397-1399, issn 0261-8028, 3 p.Article

Crystallisation of glasses in the system (BaO•4B₂O₃)_1-X(TiO₂)_xFAHMY, M. F; SUBRAMANIAN, K. N.Physics and chemistry of glasses. 1987, Vol 28, Num 2, pp 49-54, issn 0031-9090Article