au.\*:("TSAU, Christine H")
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Fabrication of wafer-level thermocompression bondsTSAU, Christine H; SPEARING, S. Mark; SCHMIDT, Martin A et al.Journal of microelectromechanical systems. 2002, Vol 11, Num 6, pp 641-647, issn 1057-7157, 7 p.Article
Low-temperature, wafer-level, gold thermocompression bonding : Modeling of flatness deviations and associated process optimization for high yield and tough bondsSTAMOULIS, Konstantinos; TSAU, Christine H; SPEARING, S. Mark et al.SPIE proceedings series. 2005, pp 42-52, isbn 0-8194-5690-X, 11 p.Conference Paper
Vacuum-packaged suspended microchannel resonant mass sensor for biomolecular detectionBURG, Thomas P; MIRZA, Amir R; MILOVIC, Nebojsa et al.Journal of microelectromechanical systems. 2006, Vol 15, Num 6, pp 1466-1476, issn 1057-7157, 11 p.Article