au.\*:("Techniques de l'informatique et de la microélectronique pour l'architecture d'ordinateurs")
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TIMA laboratory - annual report 19921993, 191 p.Report
HW/SW codesign (Grenoble, 16-18 September 1998)MEDEA/ESPRIT Conference. 1998, isbn 2-913329-00-4, 330 p., isbn 2-913329-00-4Conference Proceedings
6th international workshop on THERmal INvestigations of ICs and Systems (Budapest, 24-27 September 2000)THERMINIC 2000. International workshopBudapest University of Technology and Economics. 2000, isbn 2-913329-51-9, XI, 275 p, isbn 2-913329-51-9Conference Proceedings
10th international workshop on THERmal INvestigations of ICs and Systems (Sophia Antipolis, 29 September - 1 October 2004)THERMINIC 2004. International workshopIEEE Computer Society. 2004, isbn 2-84813-036-9, X, 335 p, isbn 2-84813-036-9Conference Proceedings
TLM solutions for static thermal problemsDE COGAN, D.THERMINIC 2000. International workshopBudapest University of Technology and Economics. 2000, pp 49-53, isbn 2-913329-51-9Conference Paper
General needs on nanoscale thermal metrology and the Japanese program on this subjectBABA, Tetsuya.THERMINIC 2004. International workshopIEEE Computer Society. 2004, pp 241-249, isbn 2-84813-036-9, 9 p.Conference Paper
Bow-free assembly: Predicted stressesSUHIR, E.THERMINIC 2004. International workshopIEEE Computer Society. 2004, pp 171-176, isbn 2-84813-036-9, 6 p.Conference Paper
Fundamental performance limits of heatsinksCOPELAND, David.THERMINIC 2000. International workshopBudapest University of Technology and Economics. 2000, isbn 2-913329-51-9, p. 157Conference Paper
Transverse temperature gradient effect on fin efficiency for micro-channel designNABIL-SABRY, Mohamed.THERMINIC 2000. International workshopBudapest University of Technology and Economics. 2000, pp 167-175, isbn 2-913329-51-9Conference Paper
International workshop on thermal investigations of ICs and microstructures (Rome, 03-06 October 1999)THERMINIC : international workshop on thermal investigations of ICs and microstructures. 1999, isbn 2-913329-32-2, XIII, 370 p, isbn 2-913329-32-2Conference Proceedings
International workshop on thermal investigations of ICs and microstructures (Cannes, 27-29 September 1998)THERMINIC : international workshop on thermal investigations of ICs and microstructures. 1998, isbn 2-913329-01-2, VII, 241 p, isbn 2-913329-01-2Conference Proceedings
Higher order compact thermal modelsSABRY, Mohamed-Nabil.THERMINIC 2004. International workshopIEEE Computer Society. 2004, pp 273-280, isbn 2-84813-036-9, 8 p.Conference Paper
Influence of tasks scheduling on average and peak temperatures of CMOS circuitsSZCZESNIAK, Wladyslaw.THERMINIC 2000. International workshopBudapest University of Technology and Economics. 2000, pp 109-112, isbn 2-913329-51-9Conference Paper
Photoacoustic amplitude method of determining of the thermal diffusivity of non-opaque materialsSUSZYNSKI, Zbigniew.THERMINIC 2000. International workshopBudapest University of Technology and Economics. 2000, pp 116-119, isbn 2-913329-51-9Conference Paper
Temperature mapping of ICs and MEMS devices using an infrared microscopeTRIGG, A. D.THERMINIC 2000. International workshopBudapest University of Technology and Economics. 2000, pp 40-45, isbn 2-913329-51-9Conference Paper
Advances in mesoscale thermal management technologies for microelectronicsGARIMELLA, Suresh V.THERMINIC 2004. International workshopIEEE Computer Society. 2004, pp 185-206, isbn 2-84813-036-9, 22 p.Conference Paper
A method for comparing heat sinks based on Reynolds analogyMÄLHAMMAR, Ake.THERMINIC 2004. International workshopIEEE Computer Society. 2004, pp 229-234, isbn 2-84813-036-9, 6 p.Conference Paper
The effect of package size and network topology on the boundary condition independence of compact thermal models of ball grid array type packagesKARIMANAL, Kamal V.THERMINIC 2004. International workshopIEEE Computer Society. 2004, pp 293-298, isbn 2-84813-036-9, 6 p.Conference Paper
A new undergraduate course on thermal design of MCMsTZANOVA, Slavka; VIDEKOV, Valentin.THERMINIC 2000. International workshopBudapest University of Technology and Economics. 2000, pp 71-74, isbn 2-913329-51-9Conference Paper
Enhanced boiling heat transfer by submerged ultrasonic vibrationsHEFFINGTON, S; GLEZER, A.THERMINIC 2004. International workshopIEEE Computer Society. 2004, pp 217-221, isbn 2-84813-036-9, 5 p.Conference Paper
A new picosecond thermoreflectance technique for thermal diffusivity measurements of nanoscale metal thin filmsTAKETOSHI, Naoyuki; BABA, Tetsuya.THERMINIC 2004. International workshopIEEE Computer Society. 2004, pp 15-18, isbn 2-84813-036-9, 4 p.Conference Paper
Time dependent temperature fields calculated using eigenfunctions and eigenvalues of the heat conduction equationGERSTENMAIER, Y. C; WACHUTKA, G.THERMINIC 2000. International workshopBudapest University of Technology and Economics. 2000, pp 55-61, isbn 2-913329-51-9Conference Paper
Transistor-thermistor made of a MOSFETKIMURA, Mitsuteru; GOTOH, Yasushi.THERMINIC 2000. International workshopBudapest University of Technology and Economics. 2000, pp 258-261, isbn 2-913329-51-9Conference Paper
Turbulence modelling for unsteady flowsTUCKER, P. G; PAN, Z.THERMINIC 2000. International workshopBudapest University of Technology and Economics. 2000, pp 101-104, isbn 2-913329-51-9Conference Paper
Examination of the bipolar transistor's soldering quality : Theory and experimentSUSZYNSKI, Z.THERMINIC : international workshop on thermal investigations of ICs and microstructures. 1998, pp 23-28, isbn 2-913329-01-2Conference Paper