A Compliant MEMS Device for Out-of-Plane Displacements With Thermo-Electric ActuationVITELLARO, Giuseppe; L'EPISCOPO, Gaetano; TRIGONA, Carlo et al.Journal of microelectromechanical systems. 2014, Vol 23, Num 3, pp 661-671, issn 1057-7157, 11 p.Article

A Feedback Controlled MEMS Nanopositioner for On-Chip High-Speed AFMMOHAMMADI, Ali; FOWLER, Anthony G; YONG, Yuen K et al.Journal of microelectromechanical systems. 2014, Vol 23, Num 3, pp 610-619, issn 1057-7157, 10 p.Article

A hermetic and room-temperature wafer bonding technique based on integrated reactive multilayer systemsBRAEUER, J; GESSNER, T.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 11, issn 0960-1317, 115002.1-115002.9Article

A low cost micro-heater for aerosol generation applicationsGUANNAN LIU; LOWY, Daniel A; KAHRIM, Amir et al.Microelectronic engineering. 2014, Vol 129, pp 46-52, issn 0167-9317, 7 p.Article

A new method for fast anodic bonding in microsystem technologySINGH, Kulwant; JOYCE, Robin; VARGHESE, Soney et al.Microsystem technologies. 2014, Vol 20, Num 7, pp 1345-1349, issn 0946-7076, 5 p.Article

A review on applications of carbon nanotubes and graphenes as nano-resonator sensorsQUAN WANG; ARASH, Behrouz.Computational materials science. 2014, Vol 82, pp 350-360, issn 0927-0256, 11 p.Article

An investigation of the mechanical strengthening effect of hydrogen anneal for silicon torsion barHAJIKA, Ryo; YOSHIDA, Shinya; KANAMORI, Yoshiaki et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 10, issn 0960-1317, 105014.1-105014.11Article

Analytical formulation of modal frequency split in the elliptical mode of SCS micromechanical disk resonatorsXUEYONG WEI; SESHIA, Ashwin A.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 2, issn 0960-1317, 025011.1-025011.7Article

Anchor-free NEMS non-volatile memory cell for harsh environment data storageSINGH, Pushpapraj; GENG LI CHUA; YING SHUN LIANG et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 11, issn 0960-1317, 115007.1-115007.7Article

Design and calibration of a six-axis MEMS sensor array for use in scoliosis correction surgeryBENFIELD, David; SHICHAO YUE; LOU, Edmond et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 8, issn 0960-1317, 085008.1-085008.8Article

Design and development of a CPW-based 5-bit switched-line phase shifter using inline metal contact MEMS series switches for 17.25 GHz transmit/receive module applicationDEY, Sukomal; KOUL, Shiban K.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 1, issn 0960-1317, 015005.1-015005.24Article

Design and fabrication of a micromachined gyroscope with high shock resistanceJIAN ZHOU; TAO JIANG; JIAO, Ji-Wei et al.Microsystem technologies. 2014, Vol 20, Num 1, pp 137-144, issn 0946-7076, 8 p.Article

Design of MEMS based three-axis motion stage by incorporating a nested structureKIM, Y.-S; DAGALAKIS, N. G; GUPTA, S. K et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 7, issn 0960-1317, 075009.1-075009.11Article

Design of RF MEMS Based Oscillatory Neural Network for Ultra High Speed Associative MemoriesBAGHELANI, Masoud; EBRAHIMI, Afshin; HABIB BADRI GHAVIFEKR et al.Neural processing letters. 2014, Vol 40, Num 1, pp 93-102, issn 1370-4621, 10 p.Article

Displacement Measurement With a Self-Sensing MEMS Electrostatic DriveMOORE, Steven I; MOHEIMANI, S. O. Reza.Journal of microelectromechanical systems. 2014, Vol 23, Num 3, pp 511-513, issn 1057-7157, 3 p.Article

Electrostatic Energy Harvester Employing Conductive Droplet and Thin-Film ElectretZHAOCHU YANG; HALVORSEN, Einar; TAO DONG et al.Journal of microelectromechanical systems. 2014, Vol 23, Num 2, pp 315-323, issn 1057-7157, 9 p.Article

Experimental investigation of laminar flow across short micro pin fin arraysDONGZHI GUO; JINSHENG GAO; SANTHANAM, Suresh et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 9, issn 0960-1317, 095011.1-095011.9Article

Experimental verification of frequency decoupling effect on acceleration sensitivity in tuning fork gyroscopes using in-plane coupled resonatorsPRAVEEN SINGH THAKUR; SUGANO, Koji; TSUCHIYA, Toshiyuki et al.Microsystem technologies. 2014, Vol 20, Num 3, pp 403-411, issn 0946-7076, 9 p.Article

Fabrication and Characterization of a Novel Nanoscale Thermal Anemometry ProbeVALLIKIVI, Margit; SMITS, Alexander J.Journal of microelectromechanical systems. 2014, Vol 23, Num 4, pp 899-907, issn 1057-7157, 9 p.Article

Fabrication of nanoplate resonating structures via micro-masonryBHASWARA, A; KEUM, H; RHEE, S et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 11, issn 0960-1317, 115012.1-115012.8Article

Fabrication, Characterization, and Modeling of Fully-Batch-Fabricated Piston-Type Electrodynamic MicroactuatorsSAWANT, Shashank G; NAIGANG WANG; HANNA, Mina S et al.Journal of microelectromechanical systems. 2014, Vol 23, Num 1, pp 220-229, issn 1057-7157, 10 p.Article

Flexible Implantable Microtemperature Sensor Fabricated on Polymer Capillary by Programmable UV Lithography With Multilayer Alignment for Biomedical ApplicationsZHUOQING YANG; YI ZHANG; ITOH, Toshihiro et al.Journal of microelectromechanical systems. 2014, Vol 23, Num 1, pp 21-29, issn 1057-7157, 9 p.Article

Gas chemical sensitivity of a CMOS MEMS cantilever functionalized via evaporation driven assemblyDORSEY, K. L; BEDAIR, S. S; FEDDER, G. K et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 7, issn 0960-1317, 075001.1-075001.8Article

Highly Integrable Pressurized Microvalve for Portable SU-8 Microfluidic PlatformsPERDIGONES, Francisco; ARACIL, Carmen; MORENO, José M et al.Journal of microelectromechanical systems. 2014, Vol 23, Num 2, pp 398-405, issn 1057-7157, 8 p.Article

Impedance Based Characterization of a High-Coupled Screen Printed PZT Thick Film Unimorph Energy HarvesterANDERS LEI; RUICHAO XU; BORREGAARD, Louise M et al.Journal of microelectromechanical systems. 2014, Vol 23, Num 4, pp 842-854, issn 1057-7157, 13 p.Article