Fabrication of hydrophobic fluorinated amorphous carbon thin films by an electrochemical routeGANG CHEN; JUNYAN ZHANG; SHENGRONG YANG et al.Electrochemistry communications. 2008, Vol 10, Num 1, pp 7-11, issn 1388-2481, 5 p.Article

Study of polycrystalline Ba_1-xCa_xMoO₄ films prepared by electrochemical techniqueYU, P; BI, J; GAO, D. J et al.Journal of electroceramics. 2008, Vol 21, Num 1-4, pp 184-188, issn 1385-3449, 5 p.Conference Paper

Anodic oxidation of tantalum in water and biological solutions using current limiting constant voltage methodWOSU, Sylvanus N.Journal of materials science. 2007, Vol 42, Num 11, pp 4087-4097, issn 0022-2461, 11 p.Article

Properties of GaAs films deposited by pulse periodic techniqueMURALI, K. R.Journal of materials science. 2007, Vol 42, Num 4, pp 1321-1324, issn 0022-2461, 4 p.Article

Electrochemical deposition of copper and ruthenium on titaniumKIM, Young-Soon; KIM, Hyung-Il; CHO, Joong-Hee et al.Electrochimica acta. 2006, Vol 51, Num 25, pp 5445-5451, issn 0013-4686, 7 p.Article

High catalytic potential of Ag/Pd nanoparticles from self-regulated reduction method on electroless Ni depositionLEE, Chien-Liang; HUANG, Yu-Ching; KUO, Li-Chen et al.Electrochemistry communications. 2006, Vol 8, Num 6, pp 1021-1026, issn 1388-2481, 6 p.Article

Fabrication of titania dense layers by electrophoretic deposition in aqueous mediaLEBRETTE, S; PAGNOUX, C; ABELARD, P et al.Journal of the European Ceramic Society. 2006, Vol 26, Num 13, pp 2727-2734, issn 0955-2219, 8 p.Article

Residual stress in Ni-W electrodepositsMIZUSHIMA, Io; TANG, Peter T; HANSEN, Hans N et al.Electrochimica acta. 2006, Vol 51, Num 27, pp 6128-6134, issn 0013-4686, 7 p.Conference Paper

Silicon effects on formation of EPO oxide coatings on aluminum alloysWANG, L; NIE, X.Thin solid films. 2006, Vol 494, Num 1-2, pp 211-218, issn 0040-6090, 8 p.Conference Paper

Electrodeposition of noble metal nanoparticles on carbon nanotubesQUINN, Bernadette M; DEKKER, Cees; LEMAY, Serge G et al.Journal of the American Chemical Society. 2005, Vol 127, Num 17, pp 6146-6147, issn 0002-7863, 2 p.Article

Electrochemical deposition and characterization of wide band semiconductor ZnO thin filmJIAN WENG; YONGJUN ZHANG; GUANQI HAN et al.Thin solid films. 2005, Vol 478, Num 1-2, pp 25-29, issn 0040-6090, 5 p.Article

Electroless gold deposition on silicon(100) wafer based on a seed layer of silverJING, F; TONG, H; KONG, L et al.Applied physics. A, Materials science & processing (Print). 2005, Vol 80, Num 3, pp 597-600, issn 0947-8396, 4 p.Article

Galvanostatic and potentiostatic deposition of bismuth telluride films from nitric acid solution : Effect of chemical and electrochemical parametersMICHEL, S; DILIBERTO, S; BOULANGER, C et al.Journal of crystal growth. 2005, Vol 277, Num 1-4, pp 274-283, issn 0022-0248, 10 p.Article

Growth of limited quantum dot chains of cadmium hydroxide thin films by chemical routeMANE, R. S; HAN, Sung-Hwan.Electrochemistry communications. 2005, Vol 7, Num 2, pp 205-208, issn 1388-2481, 4 p.Article

Moldless electroplating for cylindrical microchannel fabricationYI, Yuheon; KANG, Joo H; PARK, Je-Kyun et al.Electrochemistry communications. 2005, Vol 7, Num 9, pp 913-917, issn 1388-2481, 5 p.Article

Properties of tin sulphide thin films electrodeposited in the presence of triethanolamineZAINAL, Z; NAGALINGAM, S; HUA, T. M et al.Journal of materials science. Materials in electronics. 2005, Vol 16, Num 5, pp 281-285, issn 0957-4522, 5 p.Article

Various carbon nanofiber-copper composite films prepared by electrodepositionARAI, Susumu; ENDO, Morinobu.Electrochemistry communications. 2005, Vol 7, Num 1, pp 19-22, issn 1388-2481, 4 p.Article

Anodizing process of Al films on Si substrates for forming alumina templates with short-distance ordered 25 nm nanoporesMEI, Y. F; WU, X. L; QIU, T et al.Thin solid films. 2005, Vol 492, Num 1-2, pp 66-70, issn 0040-6090, 5 p.Article

Phase structure of electrodeposited alloysCAVALLOTTI, P. L; NOBILI, L; VICENZO, A et al.Electrochimica acta. 2005, Vol 50, Num 23, pp 4557-4565, issn 0013-4686, 9 p.Conference Paper

Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applicationsTOGASAKI, Norihiro; OKINAKA, Yutaka; HOMMA, Takayuki et al.Electrochimica acta. 2005, Vol 51, Num 5, pp 882-887, issn 0013-4686, 6 p.Conference Paper

Study of the electrodeposition of In₂S₃ thin filmsASENJO, B; CHAPARRO, A. M; GUTIERREZ, M. T et al.Thin solid films. 2005, Vol 480-81, pp 151-156, issn 0040-6090, 6 p.Conference Paper

Alloy formation in the system Au(111)/Cd during the UPD processDEL BARRIO, M. C; GARCIA, S. G; SALINAS, D. R et al.Electrochemistry communications. 2004, Vol 6, Num 8, pp 762-766, issn 1388-2481, 5 p.Article

Comparison of the structure and chemical composition of crystalline and amorphous electroless Ni-W-P coatingsVALOVA, E; ARMYANOV, S; FRANQUET, A et al.Journal of the Electrochemical Society. 2004, Vol 151, Num 6, pp C385-C391, issn 0013-4651Article

Current-time and current-potential profiles in electrochemical film production. (II) Theoretical current potential curvesD'AJELLO, P. C. T; SCHERVENSKI, A. Q.Journal of electroanalytical chemistry (1992). 2004, Vol 573, Num 1, pp 37-42, issn 1572-6657, 6 p.Article

Deposition of silver oxysalts and their antimicrobial propertiesDJOKIC, Stojan S.Journal of the Electrochemical Society. 2004, Vol 151, Num 6, pp C359-C364, issn 0013-4651Article