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Electrical Modeling and Design of a Wafer-Level Package for MEM ResonatorsPERRUISSEAU-CARRIER, Julien; MAZZA, Marco; JOURDAIN, Anne et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 2, pp 534-542, issn 1521-3323, 9 p.Article

Wafer-to-Wafer Alignment for Three-Dimensional Integration: A ReviewLEE, Sang Hwui; CHEN, Kuan-Neng; LU, James Jian-Qiang et al.Journal of microelectromechanical systems. 2011, Vol 20, Num 4, pp 885-898, issn 1057-7157, 14 p.Article

Encapsulated submillimeter piezoresistive accelerometersPARK, Woo-Tae; PARTRIDGE, Aaron; CANDLER, Rob N et al.Journal of microelectromechanical systems. 2006, Vol 15, Num 3, pp 507-514, issn 1057-7157, 8 p.Article

Wafer-level packaging based on uniquely orienting self-assembly (the DUO-SPASS processes)JIANDONG FANG; BOHRINGEI, Karl F.Journal of microelectromechanical systems. 2006, Vol 15, Num 3, pp 531-540, issn 1057-7157, 10 p.Article

Yield Enhancement by Bad-Die Recycling and Stacking With Though-Silicon ViasCHOU, Yung-Fa; KWAI, Ding-Ming; WU, Cheng-Wen et al.IEEE transactions on very large scale integration (VLSI) systems. 2011, Vol 19, Num 8, pp 1346-1356, issn 1063-8210, 11 p.Article

Fabrication and Electrical Evaluation of Via Last Polymer Liner TSVsTEZCAN, Deniz S; MAJEED, Bivragh; CIVALE, Yann et al.Journal of microelectronics and electronic packaging. 2010, Vol 7, Num 3, pp 125-130, issn 1551-4897, 6 p.Article

Wafer Level Processing of Integrated Passive Components Using Polyimide or Polybenzoxazole/Copper Multilayer TechnologyZOSCHKE, Kai; FISCHER, Thorsten; TÖPPER, Michael et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 2, pp 398-407, issn 1521-3323, 10 p.Article

Wafer-Level Epitaxial Silicon Packaging for Out-of-Plane RF MEMS Resonators with Integrated Actuation ElectrodesCHEN, Kuan-Lin; SHASHA WANG; SALVIA, James C et al.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2011, Vol 1, Num 3-4, pp 310-317, issn 2156-3950, 8 p.Article

Novel SU-8 based vacuum wafer-level packaging for MEMS devicesMURILLO, Gonzalo; DAVIS, Zachary J; KELLER, Stephan et al.Microelectronic engineering. 2010, Vol 87, Num 5-8, pp 1173-1176, issn 0167-9317, 4 p.Conference Paper

Miniaturization of a Laser Doppler Blood Flow Sensor by System-in-Package Technology: Fusion of an Optical Microelectromechanical Systems Chip and Integrated Circuits : State-of-the-art MEMS TecnologiesIWASAKI, Wataru; NOGAMI, Hirofumi; HIGURASHI, Eiji et al.IEEJ transactions on electrical and electronic engineering. 2010, Vol 5, Num 2, pp 137-142, issn 1931-4973, 6 p.Article

High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)YING YING LIM; XIANGHUA XIAO; SHIGUO LIU et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 4, pp 1061-1071, issn 1521-3323, 11 p.Article

Development of a 3-D Process Technology for Wafer-Level Packaging of MEMS DevicesCHOI, Woo-Chang; CHOI, Hyun-Jin.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2012, Vol 2, Num 9-10, pp 1442-1448, issn 2156-3950, 7 p.Article

Wafer level package with thermal-stress-absorbing interface structure and elongated padKIM, Gu-Sung; SARAH EUNKYUNG LIM.Microelectronic engineering. 2012, Vol 89, pp 70-75, issn 0167-9317, 6 p.Conference Paper

Micromachining of Pyrex 7740 Glass by Silicon Molding and Vacuum Anodic BondingJUNWEN LIU; JINTANG SHANG; JIEYING TANG et al.Journal of microelectromechanical systems. 2011, Vol 20, Num 4, pp 909-915, issn 1057-7157, 7 p.Article

Design, analysis, and development of novel three-dimensional stacking WLCSP : Three-dimensional packagingYUAN, Chang-Ann; CHENG NAN HAN; YEW, Ming-Chih et al.IEEE transactions on advanced packaging. 2005, Vol 28, Num 3, pp 387-396, issn 1521-3323, 10 p.Article

Development of Stretch Solder Interconnections for Wafer Level PackagingRAJOO, R; LIM, S. S; WONG, E. H et al.IEEE transactions on advanced packaging. 2008, Vol 31, Num 2, pp 377-385, issn 1521-3323, 9 p.Article

A Ruthenium-Based Multimetal-Contact RF MEMS Switch With a Corrugated DiaphragmFEIXIANG KE; JIANMIN MIAO; OBERHAMMER, Joachim et al.Journal of microelectromechanical systems. 2008, Vol 17, Num 6, pp 1447-1459, issn 1057-7157, 13 p.Article

Fabrication of a Micromachined Two-Dimensional Wind Sensor by Au-Au Wafer Bonding TechnologyZIQIANG DONG; JINGJING CHEN; YUKUN QIN et al.Journal of microelectromechanical systems. 2012, Vol 21, Num 2, pp 467-475, issn 1057-7157, 9 p.Article

Electrical/Mechanical Modeling, Reliability Assessment, and Fabrication of FlexConnects: A MEMS-Based Compliant Chip-to-Substrate InterconnectKACKER, Karan; SITARAMAN, Suresh K.Journal of microelectromechanical systems. 2009, Vol 18, Num 2, pp 322-331, issn 1057-7157, 10 p.Article

Mechanical Design and Characterization for MEMS Thin-Film PackagingSANTAGATA, Fabio; ZAAL, Jeroen J. M; HUERTA, Victor Gonzalez et al.Journal of microelectromechanical systems. 2012, Vol 21, Num 1, pp 100-109, issn 1057-7157, 10 p.Article

A wafer-level microcap array to enable high-yield microsystem packagingCHIANG, Yuh-Min Johnson; BACHMAN, Mark; LI, G. P et al.IEEE transactions on advanced packaging. 2004, Vol 27, Num 3, pp 490-496, issn 1521-3323, 7 p.Article

Moldless encapsulation for LED wafer level packaging using integrated DRIE trenchesRONG ZHANG; RICKY LEE, S. W.Microelectronics and reliability. 2012, Vol 52, Num 5, pp 922-932, issn 0026-2714, 11 p.Article

Wafer-level packaging of silicon to glass with a BCB intermediate layer using localised laser heatingLORENZ, N; SMITH, M. D; HAND, D. P et al.Microelectronics and reliability. 2011, Vol 51, Num 12, pp 2257-2262, issn 0026-2714, 6 p.Article

The WLP-FDTD Method for Periodic Structures With Oblique Incident WaveCAI, Zhao-Yang; BIN CHEN; QIN YIN et al.IEEE transactions on antennas and propagation. 2011, Vol 59, Num 10, pp 3780-3785, issn 0018-926X, 6 p.Article