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11th International workshop on thermal investigation of ICs and systems (THERMINIC, Belgirate, Lake Maggiore, Italy, 28-30 September 2005)International workshop on thermal investigation of ICs and systems. 2005, isbn 2-916187-01-4, 1Vol, XII-305 p, isbn 2-916187-01-4Conference Proceedings

Twentieth annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2004, March 9-11, 2004, San Jose CA, USA)Annual IEEE semiconductor thermal measurement and management symposium. 2004, isbn 0-7803-8363-X, 1Vol, XIII-313 p, isbn 0-7803-8363-XConference Proceedings

17th international workshop on thermal investigations of ICs and systems (Therminic)Courtois, Bernard; Rencz, Marta.International workshop on THERMal INvestigations of ICs and Systems. 2011, isbn 978-2-355-00018-8, 1Vol, X-224 p, isbn 978-2-355-00018-8Conference Proceedings

10th international workshop on THERmal INvestigations of ICs and Systems (Sophia Antipolis, 29 September - 1 October 2004)THERMINIC 2004. International workshopIEEE Computer Society. 2004, isbn 2-84813-036-9, X, 335 p, isbn 2-84813-036-9Conference Proceedings

Overview of the workshop for hot box operatorsVAN GEEM, M. G.Journal of testing and evaluation. 1987, Vol 15, Num 3, pp 136-137, issn 0090-3973Article

Hot box operating techniques and procedures: a surveyMILLER, R. G.Journal of testing and evaluation. 1987, Vol 15, Num 3, pp 153-166, issn 0090-3973Article

Cross-verification of thermal characterisation of a micro-coolerKOHARI, Zs; BOGNAR, Gy; KOLLAR, E et al.International workshop on thermal investigation of ICs and systems. 2005, pp 263-264, isbn 2-916187-01-4, 1Vol, 2 p.Conference Paper

In Kunststoffen steckt geliehene Energie : Technologie für umweltfreundliche Verbrennung = Plastics contain an energy «deposit». Technology for environmentally compatible incinerationKNOPF, H. J.Plastverarbeiter. 1990, Vol 41, Num 9, issn 0032-1338, p. 106Article

Numerically simulating the thermal behaviors in groundwater wells of groundwater heat pumpXUEZHI ZHOU; QING GAO; XIANGLIANG CHEN et al.Energy (Oxford). 2013, Vol 61, pp 240-247, issn 0360-5442, 8 p.Article

15th international workshop on THERMal INvestigations of ICs and systems (Leuven, Belgium, 7-9 October 2009)Courtois, Bernard.International workshop on THERMal INvestigations of ICs and Systems. 2009, isbn 978-2-35500-010-2, 1Vol, X-234 p, isbn 978-2-35500-010-2Conference Proceedings

International workshop on thermal investigation of ICs and systems (THERMINIC, Aix-en-Provence, France, 24-26 september 2003)International workshop on thermal investigations of ICs and systems. 2003, isbn 2-84813-020-2, 1Vol, XI-342 p, isbn 2-84813-020-2Conference Proceedings

Calibration of the NBS calibrated hot boxZARR, R. R; BURCH, D. M; FAISON, T. K et al.Journal of testing and evaluation. 1987, Vol 15, Num 3, pp 167-177, issn 0090-3973Article

Development of a process friendly film for high performance thermal management applicationsCOLLINSAND, Andrew; CHENG, Chih-Min.SPIE proceedings series. 2003, pp 523-528, isbn 0-8194-5189-4, 6 p.Conference Paper

Modélisation du comportement thermique d'un habitat-type à MarrakechEL OMARI, M; LAKHSASSI, A.Journées internationales de thermique. 3. 1987, 640Conference Paper

Identification of Dynamic Nonlinear Thermal Transfers for Precise Correction of Bias induced by Temperature VariationsCASENAVE, Céline; MONTSENY, Gérard; CAMON, Henri et al.Symposium on design, test, integration and packaging of MEMS/MOEMS. 2010, pp 376-381, isbn 978-2-35500-011-9, 1Vol, 6 p.Conference Paper

A miniaturized cyclic PCR device: modeling and experimentsCHOU, C. F; CHANGRANI, R; ROBERTS, P et al.Microelectronic engineering. 2002, Vol 61-62, pp 921-925, issn 0167-9317Conference Paper

Long term investigation of thermal behaviour of 110 kV underground transmission lines in the Belgrade areaSREDOJEVIC, M. R; NAUMOV, R. M; POPOVIC, D. P et al.IEE conference publication. 1997, pp 3.44.1-3.44.5, issn 0537-9989, isbn 0-85296-674-1Conference Paper

Comportamiento térmico de cucharas de acería. Simulación numérica de ciclos de operación = Thermal behaviour of casting ladles. Numerical modelling of working cyclesGASTON, A; MEDINA, M.Boletín de la Sociedad Española de Cerámica y Vidrio. 1993, Vol 32, Num 5, pp 311-316, issn 0366-3175Article

Thermal performance of adobe structures with domed roofs and moist internal surfacesBAHADORI, M. N; HAGHIGHAT, F.Solar energy. 1986, Vol 36, Num 4, pp 365-375, issn 0038-092XArticle

Thermal investigations of integrated circuits and systems, THERMINIC'09RENCZ, Marta.Microelectronics journal. 2011, Vol 42, Num 4, issn 0959-8324, 48 p.Conference Proceedings

Thermal characterization of LDMOS transistors for accelerating stress testingBOSC, J. M; DUPUY, P; GIL, J et al.Microelectronics journal. 2000, Vol 31, Num 9-10, pp 747-752, issn 0959-8324Conference Paper

Comportement thermique dynamique des bâtiments : simulation et analyseLEFEBVRE, Gilles.Techniques de l'ingénieur. Génie énergétique. 1994, Vol 3, Num B2041, pp B2041.1-B2041.17, issn 1762-8741Article

A DTA of phenols. I, HalophenolsBUCKMAN, N. G; HILL, J. O; MAGEE, R. J et al.Journal of thermal analysis. 1990, Vol 36, Num 1, pp 289-308, issn 0368-4466, 20 p.Article

Thermal management of IC's using heat sinks incorporating phase change materials (PCM), cont'dMARONGIU, Maurice J; BERHE, M. K; FALLON, G. S et al.SPIE proceedings series. 2000, pp 506-511, isbn 0-930815-62-9Conference Paper

Détermination expérimentale de paramètres globaux caractéristiques du comportement thermique dynamique d'une paroi de bâtimentBERON, R; YEZOU, R; ACHARD, G et al.Journées internationales de thermique. 3. 1987, pp 580-586Conference Paper

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