THICK FILM TECHNIQUES FOR MICROWAVE INTEGRATED CIRCUITS.FOSTER TM; DIGIONDOMENICO OJ.1974; I.E.E.E. TRANS. PARTS HYBRID. PACKAG.; U.S.A.; DA. 1974; VOL. 10; NO 2; PP. 88-94; BIBL. 8 REF.Article

PRINCIPLES OF THICK FILM MATERIALS FORMULATION.WALTON B.1975; RADIO ELECTRON. ENGR; G.B.; DA. 1975; VOL. 45; NO 3; PP. 139-143; BIBL. 14 REF.Article

THICK FILM TECHNOLOGY IN 1975.HAMER DW.1975; CERAM. INDUSTRY; U.S.A.; DA. 1975; VOL. 105; NO 2; PP. 20-21Article

A THICK-FILM MICROCIRCUIT LABORATORYLUCAS MSP; DAWES WH.1973; I.E.E.E. TRANS. EDUC.; U.S.A.; DA. 1973; VOL. 16; NO 3; PP. 130-137; BIBL. 42 REF.Serial Issue

THE THICK FILM SCREEN PRINTER: GETTING THE BEST RESULTSAUSTIN BM.1972; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1972; VOL. 11; NO 9; PP. 32-40 (5 P.)Serial Issue

INFLUENCE OF ENCAPSULATING RESINS ON THE STABILITY OF THICK-FILM RESISTORS.CATTANEO A; MAGNETI MARELLI FI.1974; ALTA FREQ.; ITAL.; DA. 1974; VOL. 43; NO 12; PP. 1047-1050; BIBL. 6 REF.Article

PRODUCTION OF THICK FILM CIRCUITS BY PLASMA SPRAYING.SMYTH RT.1974; IN: SCI. TECHNOL. SURF. COATING. NATO ADV. STUDY INST.; LONDON; 1972; LONDON; ACAD. PRESS; DA. 1974; PP. 300-307; BIBL. 1 REF.Conference Paper

REALISATION DE CIRCUITS ACTIFS HYBRIDES A COUCHE EPAISSECHMIELEWSKI JW; KSEPKO J.1973; ZESZ. NAUK. POLITECH. GDANSK., ELEKTRON.; POLSKA; DA. 1973; NO 31; PP. 79-91; ABS. ANGL. RUSSE; BIBL. 14 REF.Article

LASER TRIMMING OF THICK FILM CIRCUITS.STEER P.1974; ELECTRON. COMPON.; G.B.; DA. 1974; VOL. 16; NO 15; PP. 14-15Article

THICK-FILM MATERIALS AND TECHNIQUES.ULRICH DR.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 7; PP. 276-285; BIBL. 30 REF.Article

HIGH-SPEED THICK FILM PRINTING ASSESSING THE CRITICAL VARIABLES.POLINSKY PW.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 10; PP. 26-30 (3P.)Article

USING A ROTATIONAL VISCOMETER TO CHARACTERIZE THICK FILM MATERIALS. I.ONUFER RJ; STANLEY EC.1975; INSULAT. CIRCUITS; U.S.A.; DA. 1975; VOL. 21; NO 13; PP. 31-36; BIBL. 10 REF.Article

MATERIALS DEVELOPMENT IMPROVES THICK-FILM RELIABILITYCUMMINS R.1973; ELECTRON. ENGNG; G.B.; DA. 1973; VOL. 45; NO 540; PP. 61Serial Issue

OPERATIONAL ADJUSTMENT OF THICK FILM CIRCUITSTRAVIS WJ.1972; ELECTRON. COMPON.; G.B.; DA. 1972; VOL. 13; NO 17; PP. 824-828 (3 P.)Serial Issue

HYBRIDSCHALTUNGEN IN DICKFILMTECHNIK = CIRCUITS HYBRIDES A COUCHES EPAISSESWINIGER F.1973; P.T.T. BULL. TECH.; SUISSE; DA. 1973; VOL. 51; NO 2; PP. 68-73; ABS. FR. ITALSerial Issue

IN-HOUSE ARTWORK AND SCREEN FABRICATION FOR PROTOTYPE THICK FILM CIRCUITRYSOOKIKIAN V.1972; SOLID STATE TECHNOL.; U.S.A.; DA. 1972; VOL. 15; NO 6; PP. 42-47Serial Issue

Thick film composition reproducibility and its impact on yieldsWILSON, K. M; RESUTEK, J. L.Solid state technology. 1982, Vol 25, Num 3, pp 115-118, issn 0038-111XArticle

OSCILLATOR DEVICES USING THICK-FILM TECHNOLOGY.WILLIAMS L JR.1977; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1977; VOL. 13; NO 1; PP. 91-97; BIBL. 10 REF.Article

SOPHISTICATED TECHNIQUES SOLVE INK MANUFACTURING PROBLEMS.NITRIOL WA; HODGE PM.1976; SOLID STATE TECHNOL.; U.S.A.; DA. 1976; VOL. 19; NO 3; PP. 33-37Article

INTERDIGITATED THICK FILM CAPACITORSTUCKER CE; BARNWELL PG.1973; ELECTRON. COMPON.; G.B.; DA. 1973; VOL. 14; NO 4; PP. 163-166 (3 P.); BIBL. 3 REF.Serial Issue

THICK FILM MICROELECTRONIC CIRCUITS1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 11; PP. 99-103; (3 P.)Article

FACILITIES, EQUIPMENT, AND MANUFACTURING OPERATIONS FOR CIRCUIT DEPOSITION AND TESTING.COTE RE.1975; SOLID STATE TECHNOL.; U.S.A.; DA. 1975; VOL. 18; NO 1; PP. 49-52Article

Experiences in obtaining cross belt uniformity of ±1°C in a 24 inch wide thick film conveyor furnaceDIMOCK, Fred.SPIE proceedings series. 2002, pp 860-863, isbn 0-930815-66-1, 4 p.Conference Paper

Processing polymer thick film circuitry with radiation curingGREEN, W. J.Journal of radiation curing. 1983, Vol 10, Num 2, pp 4-7, issn 0361-6428Article

A PASTE MANUFACTURER'S VIEW OF THE HYBRID INDUSTRYTAIT R.1981; MICROELECTRON. RELIAB.; ISSN 0026-2714; GBR; DA. 1981; VOL. 21; NO 6; PP. 801-811Article