Die cracking and reliable die design for flip-chip assembliesMICHAELIDES, S; SITARAMAN, S. K.IEEE transactions on advanced packaging. 1999, Vol 22, Num 4, pp 602-613, issn 1521-3323Conference Paper

Technology : Die forging of bottoms with controllable corrugation and coningKOLESOV, Yu. B.Chemical and petroleum engineering. 1998, Vol 34, Num 3-4, pp 220-221, issn 0009-2355Conference Paper

Wear mechanism of tungsten carbide dies during wet drawing of steel tyre cordsHOLLINGER, Sébastien; DEPRAETERE, Eric; GIROUX, Olivier et al.Wear. 2003, Vol 255, Num 2, pp 1291-1299, issn 0043-1648, 9 p.Conference Paper

Effective form design of electrode in electrochemical smoothing of holesHOCHENG, H; PA, P. S.International journal, advanced manufacturing technology. 2003, Vol 21, Num 12, pp 995-1004, issn 0268-3768, 10 p.Article

On the correct selection of the channel die in ECAP processesPEREZ, C. J.Scripta materialia. 2004, Vol 50, Num 3, pp 387-393, issn 1359-6462, 7 p.Article

Fast Integrated Die-to-Die Transmitted, Reflected and STARlight-2<^TM> Defect Inspection on Memory MasksLAN, Andy; HSU, Jenny; CHAKRAVARTY, Swapnajit et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, Vol 7028, pp 70281J.1-70281J.7, issn 0277-786X, isbn 978-0-8194-7243-4 0-8194-7243-3, 2Conference Paper

The optimal design of a cooling system for a die-casting die with a free form surfaceLIN, J. C.International journal, advanced manufacturing technology. 2003, Vol 21, Num 8, pp 612-619, issn 0268-3768, 8 p.Article

Special issue on moulds and diesNEE, A. Y. C.Proceedings of the Institution of Mechanical Engineers. Part B. Journal of engineering manufacture. 2002, Vol 216, Num 12, issn 0954-4054, 126 p.Serial Issue

Some observations on the low-discard stamping of thin-walled cylindrical products = Quelques observations sur l'estampage à faible chute de produits cylindriques à parois mincesGADZINSKI, S.Journal of mechanical working technology. 1986, Vol 13, Num 1, pp 39-50, issn 0378-3804Article

Physiothermodynamics of lubricant deposition on hot die surfacesYANG, L; LIU, C; SHIVPURI, R et al.CIRP annals. 2005, Vol 54, Num 1, pp 253-256, issn 0007-8506, 4 p.Conference Paper

Closed die forging analysis of polycarbonate using an upper bound approachFOX, R; LEE, D.International journal of mechanical sciences. 1989, Vol 31, Num 4, pp 265-283, issn 0020-7403Article

Upper bound analysis of extmsion from square billets through circular and square/rectangular diesAJIBOYE, Joseph S.Journal of mechanical science and technology. 2009, Vol 23, Num 2, pp 461-474, issn 1738-494X, 14 p.Article

L'automatisation d'une presse d'estampage = Automation of a die forging pressBATIT, G; KACZMAREK, B; ROUCHOUSE, G et al.Métaux déformation. 1984, Num 82, pp 35-41, issn 0153-9035Article

Die-to-database mask inspection with variable sensitivityTSUCHIYA, Hideo; TOKITA, Masakazu; NOMURA, Takehiko et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, Vol 7028, pp 70282I.1-70282I.8, issn 0277-786X, isbn 978-0-8194-7243-4 0-8194-7243-3, 2Conference Paper

Les osselets, ancêtres du jeu de désNIKULINA, Elena; SCHMÖLCKE, Ulrich.Pour la science. 2008, Num 365, pp 40-43, issn 0153-4092, 4 p.Article

On dice in AsiaFINKEL, Irving L.Orientations (Hong Kong). 2004, Vol 35, Num 6, pp 56-60, issn 0030-5448, 5 p.Article

Proposal for die polishing using a new bonding abrasive type grinding stone: Development of MAGIC grinding stoneHAGIWARA, Shinsaku; KAWASHIMA, Norimichi; UMEHARA, Noritsugu et al.Machining science and technology. 2003, Vol 7, Num 2, pp 267-279, issn 1091-0344, 13 p.Article

En portugais = The Brazilian drop forging industry = Die brasilianische GesenkschmiedeindustrieJEZSENSKY, G; SEGALLA, L.P.R.Metalurgia ABM. 1985, Vol 41, Num 337, pp 659-666, issn 0026-0983Article

Investigation of die drool phenomenon for HDPE polymer meltMUSIL, Jan; ZATLOUKAL, Martin.Chemical engineering science. 2010, Vol 65, Num 23, pp 6128-6133, issn 0009-2509, 6 p.Article

Experimental and numerical study of die filling, powder transfer and die compactionCOUBE, O; COCKS, A. C. F; WU, C.-Y et al.Powder metallurgy. 2005, Vol 48, Num 1, pp 68-76, issn 0032-5899, 9 p.Article

Caracterisation thermique des poteyages en moulage coquille gravite 2^ème phase = Thermal characterisation of die coatings in gravity chili casting 12 stagelTOMASEVIC, D; LONGA, Y; DA SILVA, A et al.Fonderie, Fondeur d'aujourd'hui. 2005, Num 245, pp 21-31, issn 0249-3136, 11 p.Article

On a method for die container design in completely closed die forgingIBHADODE, A. O. A.Journal of manufacturing science and engineering. 1997, Vol 119, Num 3, pp 438-440, issn 1087-1357Article

Solutions Strategies for Die Shift Problem in Wafer Level Compression MoldingSHARMA, Gaurav; KUMAR, Aditya; RAO, Vempati Srinivas et al.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2011, Vol 1, Num 3-4, pp 502-509, issn 2156-3950, 8 p.Article

Die forging of aluminium: innovative solutions for industrial forging operations: Part IV: Testing of experimental results under practical conditionsMEINERS, F; HORNHARDT, Ch.Aluminium (Düsseldorf). 2003, Vol 79, Num 6, pp 524-529, issn 0002-6689, 6 p.Article

On-die DFT based solutions are sufficient for testing multi-GHz interfaces in manufacturing (and are also key to enabling lower cost ATE platforms)TRIPP, Mike.Proceedings - International Test Conference. 2002, issn 1089-3539, isbn 0-7803-7542-4, p. 1232Conference Paper