Bang on for clad plating = Placage par explosionNOWELL, D.Process engineering. 1987, Vol 68, Num 8, pp 47-48, issn 0370-1859Article

Uses of cladding materials in the power generating industryCLAY, K.Stainless steel world. 1996, Vol 8, Num 8, pp 32-35, issn 1383-7184Article

Plasma bupivacaine concentrations during caudal analgesia and ilioinguinal-iliohypogastric nerve block in childrenSTOW, P. J; SCOTT, A; PHILLIPS, A et al.Anaesthesia. 1988, Vol 43, Num 8, pp 650-653, issn 0003-2409Article

Erweiterung der Holzartenpalette für die Furnierindustrie = Extension du nombre d'espèces de bois utilisées pour la production de placages = Extension of the amount of wood species used for veneer productionNAKE, R; ACHTERBERG, W.Holztechnologie. 1988, Vol 29, Num 1, pp 14-17, issn 0018-3881Article

Use of light gauge steel strip in building = Utilisation de feuilles d'acier légères en constructionLEWIS, K. G; JONES, D; GODWIN, M. J et al.Metals and materials (London). 1988, Vol 4, Num 6, pp 357-361, issn 0026-0940Article

Escalier à la française avec courbes en placages collés = French stairs with glued veneers curvesNouveau journal de charpente-menuiserie-parquets. 1989, Num 10, pp 96-97, issn 0029-4675Article

Quality control methods for anticipating problems on printed circuit board plating linesWATSON, R.Electronic manufacturing. 1988, Vol 34, Num 6, 35Article

Automating plating systems for PWB fabrication. IJOHNSON, K.Electri.onics. 1986, Vol 32, Num 12, pp 21-23, issn 0745-4309Article

Amorphous and nanograins in the bonding zone of explosive claddingYANG, Y; WANG, B; XIONG, J et al.Journal of materials science. 2006, Vol 41, Num 11, pp 3501-3505, issn 0022-2461, 5 p.Article

Multichannel plating unit for high-throughput plating of cell culturesHAMILTON, C. M; ANDERSON, M; LAPE, J et al.BioTechniques. 2002, Vol 33, Num 2, pp 420-423, issn 0736-6205, 4 p.Article

Research on applying direct plating to additive process for printed circuit boardCHIANG, Y.-Y; WANG, Y.-Y; WAN, C.-C et al.Journal of electronic materials. 2000, Vol 29, Num 8, pp 1001-1006, issn 0361-5235Article

Overview of coating thickness measurements for printed wiring board applicationsRAFFELSBERGER, P.Electri.onics. 1986, Vol 32, Num 13, pp 45-48, issn 0745-4309Article

Norian craniofacial repair system : Compatibility with resorbable and nonresorbable plating materialsGENECOV, David G; KREMER, Michael; AGARWAL, Rajiv et al.Plastic and reconstructive surgery (1963). 2007, Vol 120, Num 6, pp 1487-1495, issn 0032-1052, 9 p.Article

Plattieren - eine kostengünstige Alternative für den Einsatz metallischer Werkstoffe in der Chemietechnik = Plating―a cost―effective alternative to the use of metallic materials in chemical engineeringHORM, E.-M; KORKHAUS, J; MATTERN, P et al.Chemieingenieurtechnik. 1991, Vol 63, Num 10, pp 977-985, issn 0009-286XConference Paper

Plaqueuses de chants et encolleuses = Edge veneering and gluing machinesLa Revue du bois et de ses applications. 1995, Vol 49, Num 7, issn 0373-5133, p. 34Article

Zum Einfluss der Sprengstoffeigenschaften auf die Detonationsgeschwindigkeit = Influence des caractéristiques de l'explosif sur la vitesse de détonation = Effect of explosive properties on the detonation velocityWOLF, H; KOLBE, M; MEINEL, M et al.ZIS-Mitteilungen. 1987, Vol 29, Num 2, pp 147-153, issn 0044-1465Article

Manufacturing of multiclads using a single explosive charge = Fabrication des placages multicouches en utilisant une charge explosive uniqueSHOUKRY, S. N; HEGAZY, A. A.Propellants, explosives, pyrotechnics. 1988, Vol 13, Num 5, pp 144-148, issn 0721-3115Article

Explosion bonded clad for the oil and gas industryBANKER, J. G.Stainless steel world. 1996, Vol 8, Num 1, pp 65-69, issn 1383-7184, 4 p.Article

Integrity of craniofacial plating systems after multiple sterilization proceduresADELSON, Robert Todd; DEFATTA, Robert J; DUCIC, Yadranko et al.Journal of oral and maxillofacial surgery. 2007, Vol 65, Num 5, pp 940-944, issn 0278-2391, 5 p.Article

Melt-solid interactions in laser cladding and laser castingGEDDA, H; KAPLAN, A; POWELL, J et al.Metallurgical and materials transactions. B, Process metallurgy and materials processing science. 2005, Vol 36, Num 5, pp 683-689, issn 1073-5615, 7 p.Article

Deposition of yttria-stablized zirconia films using arc ion platingCHANG, J. T; YEH, C. H; HE, J. L et al.Surface & coatings technology. 2005, Vol 200, Num 5-6, pp 1401-1406, issn 0257-8972, 6 p.Conference Paper

Copper on-chip interconnections : A breakthrough in electrodeposition to make better chipsANDRICACOS, P. C.The Electrochemical Society interface. 1999, Vol 8, Num 1, pp 32-37, issn 1064-8208Article

Uniformity of electroless copper depositionHONMA, H; FUJINAMI, T.Hyomen gijutsu. 1991, Vol 42, Num 7, pp 736-739, issn 0915-1869Article

Reactivity between Ti and N₂-C₂H₂ mixed gas on Ti(C,N) film deposition by arc-like plasma-enhanced ion platingKAJIOKA, H; HIGUCHI, K; KAWASHIMO, Y et al.Thin solid films. 1993, Vol 228, Num 1-2, pp 280-284, issn 0040-6090Conference Paper

Focused ion beam induced deposition of platinum for repair processesTAO TAO; WILKINSON, W; MEINGAILIS, J et al.Journal of vacuum science and technology. B. Microelectronics processing and phenomena. 1991, Vol 9, Num 1, pp 162-164, issn 0734-211XArticle