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Results 1 to 25 of 21934

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Plasma enhanced atomic layer deposition of copper: A comparison of precursorsHAGEN, D. J; CONNOLLY, J; NAGLE, R et al.Surface & coatings technology. 2013, Vol 230, pp 3-12, issn 0257-8972, 10 p.Conference Paper

Air-channel fabrication for microelectromechanical systems via sacrificial photosensitive polycarbonatesJAYACHANDRAN, Joseph Paul; REED, Hollie A; HONGSHI ZHEN et al.Journal of microelectromechanical systems. 2003, Vol 12, Num 2, pp 147-159, issn 1057-7157, 13 p.Article

Electrical/Mechanical Modeling, Reliability Assessment, and Fabrication of FlexConnects: A MEMS-Based Compliant Chip-to-Substrate InterconnectKACKER, Karan; SITARAMAN, Suresh K.Journal of microelectromechanical systems. 2009, Vol 18, Num 2, pp 322-331, issn 1057-7157, 10 p.Article

Investigation of La2O3 and/or (Co,Mn)3O4 deposits on Crofer22APU for the SOFC interconnect applicationBALLAND, Alexandre; GANNON, Paul; DEIBERT, Max et al.Surface & coatings technology. 2009, Vol 203, Num 20-21, pp 3291-3296, issn 0257-8972, 6 p.Article

Interconnexions optiques en espace libre dans les calculateurs parallèles SIMD : Spécifications des systèmes complexes = Free-space optical interconnections in SIMD parallel computersCOLLETTE, T; SCHEER, P; CHUROUX, P et al.REE. Revue de l'électricité et de l'électronique. 1998, Num 4, pp 58-65, issn 1265-6534Article

Inductance modelling of SWCNT bundle interconnects using partial element equivalent circuit methodCHOUDHARY, Sudhanshu; QURESHI, S.Journal of computational electronics (Print). 2011, Vol 10, Num 1-2, pp 241-247, issn 1569-8025, 7 p.Article

Toward the integration of a single carbon nanofibre as via interconnectCOIFFIC, J. C; LE POCHE, H; MARIOLLE, D et al.Microelectronic engineering. 2008, Vol 85, Num 10, pp 1971-1974, issn 0167-9317, 4 p.Conference Paper

Adsorption of a microtubule on a charged surface affects its disassembly dynamicsYI YANG; GUZMAN, R; DEYMIER, P. A et al.Journal of nanoscience and nanotechnology (Print). 2005, Vol 5, Num 12, pp 2050-2056, issn 1533-4880, 7 p.Article

Multilink structure for fast determination of electromigration threshold productPETITPREZ, E.Microelectronic engineering. 2011, Vol 88, Num 5, pp 610-613, issn 0167-9317, 4 p.Conference Paper

ASR evaluation of different kinds of coatings on a ferritic stainless steel as SOFC interconnectsPICCARDO, P; GANNON, P; CHEVALIER, S et al.Surface & coatings technology. 2007, Vol 202, Num 4-7, pp 1221-1225, issn 0257-8972, 5 p.Conference Paper

Low-K Dielectric Compatible Wafer-Level Compliant Chip-to-Substrate Interconnects : WAfer level packaging : more of manyKACKER, Karan; LO, George C; SITARAMAN, Suresh K et al.IEEE transactions on advanced packaging. 2008, Vol 31, Num 1, pp 22-32, issn 1521-3323, 11 p.Article

Controlling chromium vaporization from interconnects with nickel coatings in solid oxide devicesGLAZOFF, Michael V; RASHKEEV, Sergey N; HERRING, J. Stephen et al.International journal of hydrogen energy. 2014, Vol 39, Num 27, pp 15031-15038, issn 0360-3199, 8 p.Article

Metallic Interconnects for Solid Oxide Fuel Cell: Performance of Reactive Element Oxide Coating During 10, 20 and 30 Months ExposureFONTANA, S; CHEVALIER, S; CABOCHE, G et al.Oxidation of metals. 2012, Vol 78, Num 5-6, pp 307-328, issn 0030-770X, 22 p.Article

Fabrication of wafer scale, aligned sub-25 nm nanowire and nanowire templates using planar edge defined alternate layer processSONKUSALE, Sachin R; AMSINCK, Christian J; NACKASHI, David P et al.Physica. E, low-dimentional systems and nanostructures. 2005, Vol 28, Num 2, pp 107-114, issn 1386-9477, 8 p.Article

Carbon-doped Cu films with self-forming passivation layerLI, X. N; DING, J. X; XU, L. Y et al.Surface & coatings technology. 2014, Vol 244, pp 9-14, issn 0257-8972, 6 p.Article

Highly stable carbon-doped Cu films on barrierless SiZHANG, X. Y; LI, X. N; NIE, L. F et al.Applied surface science. 2011, Vol 257, Num 8, pp 3636-3640, issn 0169-4332, 5 p.Article

Chromium volatility of coated and uncoated steel interconnects for SOFCsCOLLINS, C; LUCAS, J; BUCHANAN, T. L et al.Surface & coatings technology. 2006, Vol 201, Num 7, pp 4467-4470, issn 0257-8972, 4 p.Conference Paper

Electromigration in copper damascene interconnects : reservoir effects and failure analysisWEI SHAO; VAIRAGAR, A. V; TUNG, Chih-Hang et al.Surface & coatings technology. 2005, Vol 198, Num 1-3, pp 257-261, issn 0257-8972, 5 p.Conference Paper

Comparison of oxidation behaviours among three Fe-Cr based alloys for solid oxide fuel cell interconnectCHENG, Y.-N; CHU, C.-L; LEE, S et al.Corrosion engineering, science and technology. 2012, Vol 47, Num 1, pp 25-30, issn 1478-422X, 6 p.Article

A Practical Crosstalk Reduction Technique Applied to High-Density Hard Disk Interconnecting Assembly TracesOSAKLANG, S; KRUESUBTHAWORN, A; SIVARATANA, R et al.IEEE transactions on magnetics. 2011, Vol 47, Num 10, pp 4014-4017, issn 0018-9464, 4 p.Conference Paper

Surface analyses and depth profiles of oxide scales formed on alloy surfaceHORITA, Teruhisa; YUEPING XIONG; KISHIMOTO, Haruo et al.Surface and interface analysis. 2006, Vol 38, Num 4, pp 282-286, issn 0142-2421, 5 p.Conference Paper

Axial irradiance and entropy of holographic optical elements under illumination with quasi-monochromatic lightCARRETERO, L; BELENDEZ, A; FIMIA, A et al.Journal of modern optics (Print). 1997, Vol 44, Num 2, pp 431-438, issn 0950-0340Article

Compact Performance Models and Comparisons for Gigascale On-Chip Global Interconnect Technologies : Compact Interconnect Models for Gigascale IntegrationKOO, Kyung-Hoae; KAPUR, Pawan; SARASWAT, Krishna C et al.I.E.E.E. transactions on electron devices. 2009, Vol 56, Num 9, pp 1787-1798, issn 0018-9383, 12 p.Article

Inter-system communications/networkingROBINSON, J. T.Proceedings of the IEEE. 1987, Vol 75, Num 12, pp 1670-1677, issn 0018-9219Article

Voltage-dependent parameter extraction for graphene nanoribbon interconnect model through ab initio approachYAMACLI, Serhan.Thin solid films. 2014, Vol 562, pp 538-542, issn 0040-6090, 5 p.Article

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