ELECTROPLATING-PARAMETERS AND PROPERTIES OF A CU SHEETYAROVA EA; KARBASOV BG; EFIMOV AG et al.1982; Z. PRIKL. HIM.; ISSN 0044-4618; SUN; DA. 1982; VOL. 55; NO 8; PP. 1768-1771; BIBL. 4 REF.Article

APPROCHE HYDRODYNAMIQUE DE LA MORPHOLOGIE DE DEPOTS ELECTROLYTIQUES DE CUIVRE, EN TAMPON ACETATE, SUR UNE ELECTRODE A DISQUE TOURNANT EN PLATINE OU EN CUIVRE = HYDRODYNAMIC APPROACH OF COPPER ELECTROLYTIC DEPOSIT MORPHOLOGY, WITH ACETATE BUFFER ON A PLATINUM OR COPPER ROTATING DISK ELECTRODECAPRANI A; NAKACHE M; DIMICOLI JL et al.1981; C. R. SEANCES ACAD. SCI., SCI. 2; ISSN 502677; FRA; DA. 1981; VOL. 292; NO 6; PP. 521-524; ABS. ENG; BIBL. 11 REF.Article

DISSOLUTION OF PHOSPHORIZED CU ANODES IN BRIGHT ACID CU PLATING ELECTROLYTEBUKAVYATSKAS VK; STATSKYAVICHENE AV; MATULIS YU YU et al.1980; DARB.-LIET. TSR MOKSLU AKAD. SER. B; ISSN 0132-2729; SUN; DA. 1980; NO 4; PP. 3-8Article

COLORING OF ANODIZED ALUMINIUM BY AC ELECTROLYSIS IN COFFER SULFATE SOLUTION = COLORATION DE L'ALUMINIUM ANODISE PAR ELECTROLYSE SOUS COURANT ALTERNATIF DANS UNE SOLUTION DE SULFATE DE CUSAJI T; KOMINE H; AKIYAMA A et al.1979; PLAT. SURF. FINISH.; ISSN 0360-3164; USA; DA. 1979; VOL. 66; NO 11; PP. 40-43; BIBL. 9 REF.Article

DIMENSIONAL ANALYSIS OF TOOL WEAR IN ELECTRICAL DISCHARGE MACHININGJESWANI ML.1979; WEAR; NLD; DA. 1979; VOL. 55; NO 1; PP. 153-161; BIBL. 16 REF.Article

IMPROVEMENTS IN ELECTROLESS COPPER FOR AUTOMOTIVE PLASTIC TRIM = AMELIORATIONS DU DEPOT CHIMIQUE DE CU SUR PLASTIQUESARCILESI DA.1981; PLAT. SURF. FINISH.; ISSN 0360-3164; USA; DA. 1981; VOL. 68; NO 6; PP. 90-94; BIBL. 23 REF.Article

HIGH SPEED ELECTROCHEMICAL COPPER DEPOSITIONLEVIT ML; TSVETKOV IV; DAVYDOV AD et al.1982; ELEKTROHIMIJA; ISSN 0424-8570; SUN; DA. 1982; VOL. 18; NO 12; PP. 1587-1591; BIBL. 16 REF.Article

THE ELECTRODEPOSITION OF COPPER INTO A COPPER SINGLE-CRYSTAL (111) PLANE IN THE PRESENCE OF SULPHANILAMIDE = ELECTRODEPOSITION DU CUIVRE SUR LA FACE (111) D'UN MONOCRISTAL DE CUIVRE EN PRESENCE DE SULFANILAMIDESUBRAMANIAN K; NAGESWAR S.1981; SURF. TECHNOL.; ISSN 0376-4583; CHE; DA. 1981; VOL. 12; NO 2; PP. 129-134; BIBL. 15 REF.Article

POWER DISPERSION OF COPPER ELECTROLYTESKUDRYAVTSEV NT; KUZNETSOV VP; NACHINOV GN et al.1981; Z. PRIKL. HIM.; ISSN 0044-4618; SUN; DA. 1981; VOL. 54; NO 9; PP. 2030-2035; BIBL. 10 REF.Article

ELECTRODE KINETICS OF COPPER DEPOSITION FROM COPPER CYANIDE SOLUTION = CINETIQUE DU DEPOT DE CU A PAR DE CYANURE DE CU SUR ELECTRODESINITSKI RE; SRINIVASAN V; HAYNES R et al.1980; J. ELECTROCHEM. SOC.; ISSN 0013-4651; USA; DA. 1980; VOL. 127; NO 1; PP. 47-51; BIBL. 6 REF.Article

A HERITAGE IN METALS = DES SCULTPTURES EN METAL SOUDEWEBER J.1980; WELD. J.; ISSN 0043-2296; USA; DA. 1980; VOL. 59; NO 11; PP. 16-21; LOC. ISArticle

ACCUMULATION OF BY PRODUCTS IN ELECTROLESS COPPER PLATING SOLUTIONS = ACCUMULATION DES SOUS-PRODUITS LORS DU DEPOT CHIMIQUE DE CUCOUROUVELIS CI; SUTCLIFFE G.1980; PLAT. SURF. FINISH.; ISSN 0360-3164; USA; DA. 1980; VOL. 67; NO 9; PP. 71-75; BIBL. 6 REF.Article

METAL DISTRIBUTION OF METALS UNDER A DIFFUSIONNAL CONTROL OF ELECTRODEPOSITION VATEKRUGLIKOV SS; YARLYKOV MM; ARTAMONOVA EV et al.1981; ELEKTROHIMIJA; ISSN 0424-8570; SUN; DA. 1981; VOL. 17; NO 10; PP. 1554-1557; BIBL. 6 REF.Article

ACID COPPER PLATING FOR ELECTRONICS = CUIVRAGE A PARTIR D'UN BAIN ACIDE EN ELECTRONIQUETHOMPSON EW.1981; TRANS. INST. MET. FINISH.; ISSN 0020-2967; GBR; DA. 1981; VOL. 59; PART. 1; PP. 30-32Article

HIGH THROW COPPER SULPHATE BATH WITH CHLORIDES = EFFET DE L'AGITATION D'UN BAIN DE SULFATE DE CU AVEC DES CHLORURES SUR SON EFFICACITEWALKER R; COOK SD.1980; SURF. TECHNOL.; ISSN 0376-4583; CHE; DA. 1980; VOL. 11; NO 3; PP. 189-203; BIBL. 27 REF.Article

POLAROGRAPHIC INVESTIGATION ON INFLUENCE OF GELATINE AND CASEIN ON COPPER DEPOSITION = RECHERCHES POLAROGRAPHIQUES SUR L'EFFET DE LA GELATINE ET DE LA CASEINE SUR LE CUIVRAGESZYMASZEK A; BIERNAT J; PAJDOWSKI L et al.1980; POLISH J. CHEM.; POL; DA. 1980; VOL. 54; NO 1; PP. 65-70; BIBL. 14 REF.Article

CANADA'S ACCUMOLD: AN EXPLOSIVE FORCE ON THE CONTICASTING MOLD SUPPLY SCENE1980; 33 MET. PROD.; USA; DA. 1980-04; VOL. 18; NO 4; PP. 58-60Article

PROPERTIES OF ELECTROPLATED TITANIUM = PROPRIETE DU TI RECOUVERT PAR DEPOT ELECTROLYTIQUETHOMA M.1983; PLATING AND SURFACE FINISHING; ISSN 0360-3164; USA; DA. 1983; VOL. 70; NO 6; PP. 76-78; BIBL. 4 REF.Article

ANODIC BEHAVIOR OF CU ELECTRODEPOSITS FROM ACID COPPER SULFATE BATHS WITH ORGANIC SULFUR COMPOUNDSNAWAFUNE H; MIZUMOTO S; KAWASAKI M et al.1983; KINZOKU HYOMEN GIJUTSU. (JOURNAL OF THE METAL FINISHING SOCIETY OF JAPAN); ISSN 0026-0614; JPN; DA. 1983; VOL. 34; NO 2; PP. 71-75; ABS. ENG; BIBL. 11 REF.Article

EFFECT OF ACIDITY AND CHLORIDE DE IONS ON STRUCTURAL DEFECTS AND INTERNAL FRICTION CU ELECTROCOATINGSMAMONTOV EA; KURBATOVA LA; GUSLIKOV VM et al.1982; ELEKTROHIMIJA; ISSN 0424-8570; SUN; DA. 1982; VOL. 18; NO 4; PP. 552-555; BIBL. 8 REF.Article

ELECTRICAL DISCHARGE MACHINING IN DISTILLED WATERJESWANI ML.1981; WEAR; CHE; DA. 1981-10-01; VOL. 72; NO 1; PP. 81-88; BIBL. 6 REF.Article

MICRODISTRIBUTION OF ELECTRODEPOSITED CU ON A CATHODE COATED WITH CU₂SKUZNETSOVA LA; KOVARSKIJ N YA.1981; ELEKTROHIMIJA; ISSN 0424-8570; SUN; DA. 1981; VOL. 17; NO 11; PP. 1633-1637; BIBL. 4 REF.Article

STRUCTURE AND PROPERTIES OF ION PLATED COPPER FILMSTSUNASAWA E; YAMANAKA K.1981; KINZOKU HYOMEN GIJUTSU; ISSN 0026-0614; JPN; DA. 1981; VOL. 32; NO 10; PP. 515-520; ABS. ENG; BIBL. 10 REF.Article

SOME ASPECTS OF THE STRUCTURE OF THE ELECTROLESS COPPER DEPOSIT = QUELQUES ASPECTS DE LA STRUCTURE DES DEPOTS CHIMIQUES D'AUEL MALLAH AT; EL RAGHY SM; ABOU SALF EA et al.1980; PLAT. SURF. FINISH.; ISSN 0360-3164; USA; DA. 1980; VOL. 67; NO 10; PP. 61-64; BIBL. 8 REF.Article

COBALTAGE BRILLANT SANS INHIBITEUR = BRIGH COBALT COATING WITHOUT INHIBITORDEGREZ M; HUBEAU V; WINAND R et al.1980; METALLURGIE (MONS); ISSN 0543-5757; BEL; DA. 1980; VOL. 20; NO 3-4; PP. 95-101; BIBL. 14 REF.Article