THE ELECTRODEPOSITION OF COPPER INTO A COPPER SINGLE-CRYSTAL (111) PLANE IN THE PRESENCE OF SULPHANILAMIDE = ELECTRODEPOSITION DU CUIVRE SUR LA FACE (111) D'UN MONOCRISTAL DE CUIVRE EN PRESENCE DE SULFANILAMIDESUBRAMANIAN K; NAGESWAR S.1981; SURF. TECHNOL.; ISSN 0376-4583; CHE; DA. 1981; VOL. 12; NO 2; PP. 129-134; BIBL. 15 REF.Article

ELECTRODE KINETICS OF COPPER DEPOSITION FROM COPPER CYANIDE SOLUTION = CINETIQUE DU DEPOT DE CU A PAR DE CYANURE DE CU SUR ELECTRODESINITSKI RE; SRINIVASAN V; HAYNES R et al.1980; J. ELECTROCHEM. SOC.; ISSN 0013-4651; USA; DA. 1980; VOL. 127; NO 1; PP. 47-51; BIBL. 6 REF.Article

CANADA'S ACCUMOLD: AN EXPLOSIVE FORCE ON THE CONTICASTING MOLD SUPPLY SCENE1980; 33 MET. PROD.; USA; DA. 1980-04; VOL. 18; NO 4; PP. 58-60Article

ADSORPTION BEHAVIOUR OF SOME BRIGHTENING AGENTS USED IN ELECTROLYTIC COPPER DEPOSITION FROM ACID SOLUTIONS = ADSORPTION DE QUELQUES BRILLANTEURS UTILISES DANS LE DEPOT ELECTROLYTIQUE DE CU EN MILIEU ACIDESTOYCHEV DS; VITANOV IB; VITANOV TD et al.1979; DOKL. BOLG. AKAD. NAUK; ISSN 0366-8681; BGR; DA. 1979; VOL. 32; NO 11; PP. 1515-1518; BIBL. 10 REF.Article

PROMOTION AND MARKET DEVELOPMENT FOR COPPER = PROMOTION ET DEVELOPPEMENT DU MARCHE DU CUIVREDAVIES MH; VON FRANQUE O.1980; MING MAG.; GBR; DA. 1980; VOL. 142; NO 2; PP. 148-153; (4 P.)Article

PENETRATION OF SEMI-INFINITE METAL TARGETS BY DEFORMING PROJECTILES = PENETRATION DANS DES CIBLES METALLIQUES SEMI-INFINIES PAR DES PROJECTILES DEFORMABLESWOODWARD RL.1982; INT. J. MECH. SCI.; ISSN 0020-7403; GBR; DA. 1982; VOL. 24; NO 2; PP. 73-87; BIBL. 27 REF.Article

EROSION OF ELECTRODES IN SPARK HARDENINGZHURA VI; LAPSHIN SP; YUKHNENKO VV et al.1981; ELEKTRON. OBRAB. MATER.; SUN; DA. 1981-10; VOL. 5; PP. 19-21; BIBL. 10 REF.Article

THE EFFECT OF SULPHANILAMIDE ON THE ELECTRODEPOSITION OF COPPER ONTO A SINGLE-CRYSTAL CU(100) PLANE AND A POLYCRYSTALLINE COPPER SUBSTRATE = EFFET DE LA SULFANILAMIDE SUR LE DEPOT ELECTROLYTIQUE DU CU SUR LES PLANS (100) DES MONOCRISTAUX DE CU ET UN SUBSTRAT DE CU POLYCRISTALLINSUBRAMANIAN K; NAGESWAR S.1980; SURF. TECHNOL.; ISSN 0376-4583; CHE; DA. 1980; VOL. 11; NO 2; PP. 73-81; BIBL. 18 REF.Article

THE EFFECT OF SULPHANILAMIDE ON THE ELECTROCRYSTALLIZATION OF COPPER ON A SINGLE-CRYSTAL CU(110) PLANE = EFFET DE LA SULFAANILAMIDE SUR L'ELECTROCRISTALLISATION DU CU SUR UN PLAN D'UN MONOCRISTAL CU(110)SUBRAMANIAN K; NAGESWAR S.1980; SURF. TECHNOL.; ISSN 0376-4583; CHE; DA. 1980; VOL. 11; NO 2; PP. 83-90; BIBL. 15 REF.Article

ANODIC DISSOLUTION OF METALS STUDIED BY QUANTIC CHEMISTRY MODELSSHAPNIK MS; KUZNETSOV AM.1982; ELEKTROHIMIJA; ISSN 0424-8570; SUN; DA. 1982; VOL. 18; NO 10; PP. 1418-1420; BIBL. 3 REF.Article

PHOTOELECTROCHEMICAL TESTING OF ANODIC DISSOLUTION OF METALSVALEEV A SH.1981; ELEKTROHIMIJA; ISSN 0424-8570; SUN; DA. 1981; VOL. 17; NO 12; PP. 1830-1836; BIBL. 5 REF.Article

SPARK GROOVING OF NARROW SLOTS IN PRODUCTION OF PARTS OF ELECTRONIC DEVICES OF COMPLEX SHAPESTAVITSKAYA NB.1981; ELEKTRON. OBRAB. MATER.; SUN; DA. 1981-10; VOL. 5; PP. 5-9; BIBL. 10 REF.Article

BAND CALCULATION OF COPPER BY AN INTERPOLATION SCHEME BASED ON RECENT PSEUDOPOTENTIAL METHODSYAMADA Y.1981; PHYS. STATUS SOLIDI, SECT. B, BASIC RES.; DDR; DA. 1981-10-01; VOL. 107; NO 2; PP. 503-512; BIBL. 15 REF.Article

ELECTROPOLISHING OF VERTICAL COPPER CYLINDERS IN PHOSPHORIC ACID UNDER NATURAL CONVECTION CONDITIONS = ELECTROPOLISSAGE DE CYLINDRES DE CUIVRE VERTICAUX DANS DE L'ACIDE PHOSPHORIQUE DANS DES CONDITIONS DE CONVECTION NATURELLESEDAHMED GH; ISKANDER SS; MANSOUR IAS et al.1980; SURF. TECHNOL.; ISSN 0376-4583; CHE; DA. 1980; VOL. 11; NO 1; PP. 67-71; BIBL. 6 REF.Article

EFFECT OF TEMPERATURE ON SHORT AND LONG TIME STRENGTH OF COPPER AND COPPER ALLOYSVOLGA VV.1980; CVET. MET.; ISSN 0372-2929; SUN; DA. 1980; NO 10; PP. 119-121; BIBL. 3 REF.Article

ELECTROLYTIC PRODUCTION OF COPPER FOILSGOLOVIN IN; BUZHINSKAYA AV; MAZURCHUK EH N et al.1980; CVET. MET.; ISSN 0372-2929; SUN; DA. 1980; NO 4; PP. 38-45Article

FREE ELECTROLYTIC COPPER FILM CREEP AT ROOM TEMPERATURETUMANOVA LA; SHERMERGOR TD.1979; FIZ. MET. METALLOVED.; ISSN 0015-3230; SUN; DA. 1979; VOL. 48; NO 3; PP. 654-657; BIBL. 5 REF.Article

FABRICATION DES CIRCUITS IMPRIMES: INTEGRATION DES PROCEDES = FABRICATION OF PRINTED CIRCUITS: PROCESSES INTEGRATIONSCHILLER W.1983; GALVANO-ORGANO; ISSN 0302-6477; FRA; DA. 1983; VOL. 52; NO 533; PP. 152-155Article

ELECTRODEPOSITION: A VIABLE COATING ALTERNATIVE = DEPOT ELECTROLYTIQUE: UNE ALTERNATIVE VIABLE DE REVETEMENTDINI JW.1982; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1982; VOL. 95; NO 2; PP. 123-129; BIBL. 36 REF.Conference Paper

SOUDOBRASAGE ET BRASAGE = BRAZE-WELDING AND BRAZINGGERBEAUX H.1982; SOUDER; ISSN 0038-173X; FRA; DA. 1982; VOL. 4; NO 4; PP. 90-97; LOC. ISArticle

COMMENTS ON THE ELECTRONIC STRUCTURE OF DIMERIC COPPER, AS CALCULATED WITH THE HARTREE-FOCK-SLATER METHOD = COMMENTAIRES SUR LA STRUCTURE ELECTRONIQUE DE CU DIMERE CALCULEE PAR LA METHODE DE HARTREE-FOCK-SLATERGUENZBURGER D.1981; NOTAS DE FISICA; ISSN 0029-3865; BRA; DA. 1981; NO 39; 13 P.; BIBL. 14 REF.Serial Issue

TIME DEPENDENCE OF RESISTANCE TO SPALL OF COPPER IN THE SUBMICROSECOND RANGEGLUSHAK BL; NOVIKOV SA; POGORELOV AP et al.1981; DOKL. AKAD. NAUK SSSR; SUN; DA. 1981-07-20; VOL. 259; NO 4; PP. 830-832; BIBL. 5 REF.Article

ELECTRODISCHARGE MACHINING: A TECHNOLOGY IN MUTATION1981; MACH. MOD.; ISSN 0024-9130; FRA; DA. 1981; NO 860; PP. 73-75Article

SOME ASPECTS OF THE CONTINUOUS EASTING OF COPPER BILLETS AT THE ELECTROLYTIC REFINING AND SMELTING CO OF AUST. LTDHARRISON D.1979; METALS AUSTRALAS.; AUS; DA. 1979; VOL. 11; NO 5; PP. 17-19Article

STRAIN-INDUCED ANODIC DISSOLUTION OF CU SINGLE CRYSTALS: EFFECTS OF SPECIMEN GEOMETRY AND SLIP MORPHOLOGY = DISSOLUTION ANODIQUE INDUITE PAR DEFORMATION DES MONOCRISTAUX DE CU: EFFET DE LA GEOMETRIE DE L'EPROUVETTE ET DE LA MORPHOLOGIE DES GLISSEMENTSNIWA H; ASAWA S; HARUYAMA S et al.1983; CORROSION SCIENCE; ISSN 0010-938X; GBR; DA. 1983; VOL. 23; NO 9; PP. 959-968; BIBL. 9 REF.Article