Solderability of capacitor lead wires = Aptitude au brasage tendre de conducteurs de condensateursGEIGER, A. L.1986, Num 11, pp 56-61, issn 0263-0060Article

Eignung von unbedrahteten Bauelementen für die Oberflächenmontage auf Leiterplatten = Aptitude de composants électroniques sans fils au montage en surface sur les substrats = Study of the solderability of surface mounted devicesRÖDIG, H.Weichlöten in Forschung und Praxis 1986. Hochschulkolloquium. 1986, pp 114-126Conference Paper

Standardisieren von Loetvorgaengen:Konstanz der Parameter ist anzustreben beim Loeten von Leiterplatten = Standardization of soldering proceduresZICKUHR, U; MUELLER, B.F.MM. Maschinenmarkt. 1986, Vol 92, Num 44, pp 58-60, issn 0341-5775Article

Some observations on the use of steel as a solderability standard = Choix de l'acier comme échantillon standard pour les essais d'aptitude au brasage tendre à l'aide d'une balance de mouillageALLEN, B. M.1987, Num 12, pp 42-47, issn 0263-0060Article

Lötbarkeit und Bindefestigkeit von beschichteten Leitungselementen = Aptitude au brasage de conducteurs électroniques revêtus = Solderability of tin-coated copper-wires on electronic componentsLEA, C.Weichlöten in Forschung und Praxis 1986. Hochschulkolloquium. 1986, pp 180-185Conference Paper

Select the Right Surface Finish to Improve SolderabilityLOPEZ, Edwin P; VIANCO, Paul T.Welding journal. 2011, Vol 90, Num 9, pp 44-46, issn 0043-2296, 3 p.Article

The effect of the hot air levelling process on skip solder defects in the wave soldering processTEO KIAT CHOON.Soldering & surface mount technology. 2003, Vol 15, Num 2, pp 4-5, issn 0954-0911, 9 p.Article

Analysis of ring and plug shear strengths for comparison of lead-free soldersFOLEY, J. C; GICKLER, A; LEPREVOST, F. H et al.Journal of electronic materials. 2000, Vol 29, Num 10, pp 1258-1263, issn 0361-5235Conference Paper

Effects of reflow on wettability, microstructure and mechanical properties in lead-free soldersGUO, F; CHOI, S; LUCAS, J. P et al.Journal of electronic materials. 2000, Vol 29, Num 10, pp 1241-1248, issn 0361-5235Conference Paper

Die Rasterbenetzungswaage als wichtiges Hilfsmittel zur Entwicklung moderner Lötverfahren in der Elektronik = Balance de mouillage à commande par ordinateur pour le développement de méthodes modernes de brasage dans l'électronique = Use of a computer-controlled wetting balance for the soldering of electronic componentsLEIBFRIED, W.Weichlöten in Forschung und Praxis 1986. Hochschulkolloquium. 1986, pp 25-37Conference Paper

Einfluss von Verunreinigungen in eutektischen Zinn-Wismuth-Lotbädern auf den Lötprozess unter Berücksichtigung des Flussmitteleinflusses = Influence des impuretés contenues dans les bains Sn-Bi et influence du flux sur le processus de brasage = Effect of impurities in Sn-Bi molten solder and of flux on the soldering processBECKER, R.Weichlöten in Forschung und Praxis 1986. Hochschulkolloquium. 1986, pp 13-24Conference Paper

Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique : Characterisation for process optimisation in surface engineeringHONG, S. J; PARK, B-H; SEO, D. S et al.Surface engineering. 2008, Vol 24, Num 5, pp 337-340, issn 0267-0844, 4 p.Article

Solder flow on narrow copper stripsHOSKING, F. M; YOST, F. G; HOLM, E. A et al.Journal of electronic materials. 1996, Vol 25, Num 7, pp 1099-1107, issn 0361-5235Conference Paper

Lead-free and reduced-lead copper-base cast plumbing alloys : evaluation of candidate U.S. compositions. IDRESHER, W. H; PETERS, D. T.Metall (Berlin, West). 1992, Vol 46, Num 11, pp 1142-1146, issn 0026-0746Article

Copper behavior during immersion deposition of tinROZOVSKIJ, G; PETRETYTE, L; GAVRILOV, G et al.Plating and surface finishing. 1990, Vol 77, Num 4, pp 60-62, issn 0360-3164, 3 p.Article

The solderability testing of surface mount devices using the GEC meniscograph solderability tester = Test de brasabilité pour le composant pour composants montés en surface. Usage du méniscographe pour test de brasabilitéGUNTER, A.1986, Vol 13, Num 1, pp 8-12, issn 0305-6120Article

Effects of PCB Substrate Surface Finish and Flux on Solderability of Lead-Free SAC305 AlloySIEWIOREK, A; KUDYBA, A; SOBCZAK, N et al.Journal of materials engineering and performance. 2013, Vol 22, Num 8, pp 2247-2252, issn 1059-9495, 6 p.Article

Numerical simulation of dynamic wetting behavior in the wetting balance method : Lead-free electronics packagingJEONG WHAN HAN; HWANG GU LEE; JAE YONG PARK et al.Materials transactions - JIM. 2002, Vol 43, Num 8, pp 1816-1820, issn 0916-1821Article

Iron-42 wt pct nickel lead frame with palladium-electroplated multi-layer for semiconductor packagesKIM, J.-D; BAEK, Y.-H; CHOI, W.-S et al.Plating and surface finishing. 1999, Vol 86, Num 6, pp 113-116, issn 0360-3164Article

Sn-Ag alloy electroplating for use as Pb-free solderARAI, S; WATANABE, T.Hyomen gijutsu. 1998, Vol 49, Num 1, pp 73-77, issn 0915-1869Article

The assessment of the solderability of surface mounted devices using the wetting balance = Utilisation de la balance de mouillage pour déterminer la brasabilité de composants montés en surfaceYOSHIDA, H; WARWICK, M. E; HAWKINS, S. P et al.1987, Num 12, pp 21-29, issn 0263-0060Article

Résistance à la chaleur de l'or ou de l'argent plaqué sur l'acier inoxydable SUS 430ARAKIDA, Y; FUKAMACHI, K; NAKAJIMA, Y et al.Kinzoku Hyomen Gijutsu. 1987, Vol 38, Num 2, pp 50-54, issn 0026-0614Article

The corrosion characteristics and solderability of immersion tin coatings on copperARAZNA, A; KROLIKOWSKI, A; KOZIOL, G et al.Materials and corrosion (1995). 2013, Vol 64, Num 10, pp 914-925, issn 0947-5117, 12 p.Article

Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder jointYOON, Jeong-Won; NOH, Bo-In; LEE, Young-Ho et al.Microelectronics and reliability. 2008, Vol 48, Num 11-12, pp 1864-1874, issn 0026-2714, 11 p.Article

Solderability of nickel electrodeposits formed under excess current densityARAI, S; TAKEMOTO, T; MIZUTANI, M et al.Hyomen gijutsu. 1993, Vol 44, Num 1, pp 50-54, issn 0915-1869Article