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Particularités de la conductivité thermique du réseau des chalcogénures de plomb PbTe, PbSe, PbSALEKSEEVA, G. T; KRYLOV, E. T.Fizika tverdogo tela. 1983, Vol 25, Num 12, pp 3713-3716, issn 0367-3294Article

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Enhanced thermal conductivity of nanofluids: a state-of-the-art reviewÖZERINC, Sezer; KAKAC, Sadik; GÜVENC YAZICIOGLU, Almila et al.Microfluidics and nanofluidics (Print). 2010, Vol 8, Num 2, pp 145-170, issn 1613-4982, 26 p.Article

Lattice thermal conductivity of layered-structure compoundsKUMAR, A; ANSARI, M. A; SRIVASTAVA, B. K et al.Physical review. B, Condensed matter. 1985, Vol 31, Num 8, pp 5509-5512, issn 0163-1829Article

Predicting the effective thermal conductivity of unfrozen, porous foodsCARSON, James K; LOVATT, Simon J; TANNER, David J et al.Journal of food engineering. 2006, Vol 75, Num 3, pp 297-307, issn 0260-8774, 11 p.Article

An application of non-commutative complementary variational principles to the calculation of phonon thermal conductivityMIKHAIL, I. F. I.Journal of physics. C. Solid state physics. 1985, Vol 18, Num 31, pp 5801-5813, issn 0022-3719Article

Recent developments in bulk thermoelectric materialsNOLAS, George S; POON, Joe; KANATZIDIS, Mercouri et al.MRS bulletin. 2006, Vol 31, Num 3, pp 199-205, issn 0883-7694, 7 p.Article

Size dependent thermal conductivity in nano-systemsGYÖRY, Erika; MARKUS, Ferenc.Thin solid films. 2014, Vol 565, pp 89-93, issn 0040-6090, 5 p.Article

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Very low temperature thermal conductivity of Kevlar 49VENTURA, G; MARTELLI, V.Cryogenics (Guildford). 2009, Vol 49, Num 7, pp 376-377, issn 0011-2275, 2 p.Article

Thermal conductivity of Kevlar 49 between 7 and 290 KVENTURA, G; MARTELLI, V.Cryogenics (Guildford). 2009, Vol 49, Num 12, pp 735-737, issn 0011-2275, 3 p.Article

CALCULATION OF THE BRT FUNCTION WITH A PROGRAMMABLE POCKET CALCULATORFAGALY RL.1980; CRYOGENICS (SURREY); ISSN 0011-2275; GBR; DA. 1980; VOL. 20; NO 11; PP. 644; BIBL. 9 REF.Article

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