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Bias sensitive multispectral structures for imaging applicationsVIEIRA, M; FANTONI, A; FEMANDES, M et al.Thin solid films. 2007, Vol 515, Num 19, pp 7566-7570, issn 0040-6090, 5 p.Conference Paper

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Effect of structural variations in amorphous silicon based single and multi-junction solar cells from numerical analysisKABIR, M. I; IBRAHIM, Zahari; SOPIAN, Kamaruzzaman et al.Solar energy materials and solar cells. 2010, Vol 94, Num 9, pp 1542-1545, issn 0927-0248, 4 p.Conference Paper

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Si-rich a-SiC:H thin films: Structural and optical transformations during thermal annealingKÜNLE, Matthias; KALTENBACH, Thomas; LOPER, Philipp et al.Thin solid films. 2010, Vol 519, Num 1, pp 151-157, issn 0040-6090, 7 p.Article

Maintaining Cu metal integrity on low-k IMDs with a nanometer thick a-SiC:H film obtained by HWCVDSINGH, S. K; KUMBHAR, A. A; DUSANE, R. O et al.Thin solid films. 2008, Vol 516, Num 5, pp 785-788, issn 0040-6090, 4 p.Conference Paper

Investigation of the tribological behavior and its relationship to the microstructure and mechanical properties of a-SiC:H films elaborated by low frequency plasma assisted chemical vapor depositionSOUM-GLAUDE, A; RAMBAUD, G; GRILLO, S. E et al.Thin solid films. 2010, Vol 519, Num 4, pp 1266-1271, issn 0040-6090, 6 p.Article

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