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The effect of zinc addition on the mechanical properties of Ni₃Al = Effet d'addition de zinc sur les propriétés mécaniques de Ni₃AlKURIKI, Y; OCHIAI, S; YODOGAWA, M et al.Transactions of the Japan institute of metals. 1985, Vol 26, Num 3, pp 213-214, issn 0021-4434Article

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Effects of Zn addition and aging treatment on tensile properties of Sn―Ag―Cu alloysHAMADA, Naoyuki; UESUGI, Tokuteru; TAKIGAWA, Yorinobu et al.Journal of alloys and compounds. 2012, Vol 527, pp 226-232, issn 0925-8388, 7 p.Article

Effects of Minor Amounts of Zn on the Sn-Zn/Ni Interfacial Reactions and Phase Equilibria of the Ternary Sn-Zn-Ni System at 250°CWANG, Chao-Hong; CHEN, Hsien-Hsin; LAI, Wei-Han et al.Journal of electronic materials. 2011, Vol 40, Num 12, pp 2436-2444, issn 0361-5235, 9 p.Article

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Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy DesignANDERSON, Iver E; WALLESER, Jason W; HARRINGA, Joel L et al.Journal of electronic materials. 2009, Vol 38, Num 12, pp 2770-2779, issn 0361-5235, 10 p.Conference Paper

Suppressing Growth of the Cu₅Zn₈ Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder JointsLAI, R. S; LIN, K. L; SALAM, B et al.Journal of electronic materials. 2009, Vol 38, Num 1, pp 88-92, issn 0361-5235, 5 p.Conference Paper

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Microstructure, Thermal and Wetting Properties of Sn-Bi-Zn Lead-Free SolderXU CHEN; FENG XUE; JIAN ZHOU et al.Journal of electronic materials. 2013, Vol 42, Num 8, pp 2708-2715, issn 0361-5235, 8 p.Article

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Effects of minor Cu additions on a Zn-modified Al-5083 alloyCARROLL, M. C; GOUMA, P. I; DAEHN, G. S et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2001, Vol 319/21, pp 425-428, issn 0921-5093Conference Paper