A 0.1-40 GHz broadband MEMS clamped-clamped beam capacitive power sensor based on GaAs technologyJUZHENG HAN; XIAOPING LIAO.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 6, issn 0960-1317, 065024.1-065024.7Article

A Large Piston Displacement MEMS Mirror With Electrothermal Ladder Actuator Arrays for Ultra-Low Tilt ApplicationsSAMUELSON, Sean R; HUIKAI XIE.Journal of microelectromechanical systems. 2014, Vol 23, Num 1, pp 39-49, issn 1057-7157, 11 p.Article

A Seismic-Grade Resonant MEMS AccelerometerXUDONG ZOU; THIRUVENKATANATHAN, Pradyumna; SESHIA, Ashwin A et al.Journal of microelectromechanical systems. 2014, Vol 23, Num 4, pp 768-770, issn 1057-7157, 3 p.Article

A Si-Micromachined 162-Stage Two-Part Knudsen Pump for On-Chip VacuumSEUNGDO AN; GUPTA, Naveen K; GIANCHANDANI, Yogesh B et al.Journal of microelectromechanical systems. 2014, Vol 23, Num 2, pp 406-416, issn 1057-7157, 11 p.Article

A Systematical Method to Determine the Internal Pressure and Hermeticity of MEMS PackagesBO WANG; DE COSTER, Jeroen; SIMONE, Severi et al.Journal of microelectromechanical systems. 2014, Vol 23, Num 4, pp 862-870, issn 1057-7157, 9 p.Article

A gyroscope fabrication method for high sensitivity and robustness to fabrication tolerancesJUNGWOO SUNG; JIN YOUNG KIM; SEYEONG SEOK et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 7, issn 0960-1317, 075013.1-075013.7Article

A laterally-driven micromachined inertial switch with a compliant cantilever beam as the stationary electrode for prolonging contact timeWENGUO CHEN; YAN WANG; YONGLIANG WANG et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 6, issn 0960-1317, 065020.1-065020.10Article

A microacoustic analysis including viscosity and thermal conductivity to model the effect of the protective cap on the acoustic response of a MEMS microphoneHOMENTCOVSCHI, D; MILES, R. N; LOEPPERT, P. V et al.Microsystem technologies. 2014, Vol 20, Num 2, pp 265-272, issn 0946-7076, 8 p.Article

A novel electrostatic based microgripper (cellgripper) integrated with contact sensor and equipped with vibrating system to release particles activelyDEMAGHSI, Hamed; MIRZAJANI, Hadi; HABIB BADRI GHAVIFEKR et al.Microsystem technologies. 2014, Vol 20, Num 12, pp 2191-2202, issn 0946-7076, 12 p.Article

A novel tri-axis MEMS gyroscope with in-plane tetra-pendulum proof masses and enhanced sensitive springsWANG, M. C; JIAO, J. W; YAN, P. L et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 4, issn 0960-1317, 045002.1-045002.10Article

A simple method for extracting material parameters of multilayered MEMS structures using resonance frequency measurementsCHAO SUN; ZHOU, Zai-Fa; LI, Wei-Hua et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 7, issn 0960-1317, 075014.1-075014.7Article

A single-input, single-output electromagnetically-transduced microresonator arraySABATER, A. B; HUNKLER, A. G; RHOADS, J. F et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 6, issn 0960-1317, 065005.1-065005.14Article

An In-Plane Approximated Nonlinear MEMS Electromagnetic Energy HarvesterHUICONG LIU; YOU QIAN; NAN WANG et al.Journal of microelectromechanical systems. 2014, Vol 23, Num 3, pp 740-749, issn 1057-7157, 10 p.Article

An analytic framework for developing inherently-manufacturable pop-up laminate devicesAUKES, Daniel M; GOLDBERG, Benjamin; CUTKOSKY, Mark R et al.Smart materials and structures. 2014, Vol 23, Num 9, issn 0964-1726, 094013.1-094013.15Article

Analytical investigation of the feasibility of sacrificial microchannel sealing for Chip-Scale Atomic MagnetometersTSUJIMOTO, Kazuya; HIRAI, Yoshikazu; SUGANO, Koji et al.Microsystem technologies. 2014, Vol 20, Num 3, pp 357-365, issn 0946-7076, 9 p.Article

CMOS integrated elliptic diaphragm capacitive pressure sensor in SiGe MEMSANANIAH DURAI SUNDARARAJAN; REZAUL HASAN, S. M.Microsystem technologies. 2014, Vol 20, Num 1, pp 145-155, issn 0946-7076, 11 p.Article

Characterization of bonding interface prepared by room-temperature Si wafer direct bonding using the surface smoothing effect of a Ne fast atom beamKURASHIMA, Yuichi; MAEDA, Atsuhiko; TAKAGI, Hideki et al.Microelectronic engineering. 2014, Vol 118, pp 1-5, issn 0167-9317, 5 p.Article

Design of multi-functional microfluidic ladder networks to passively control droplet spacing using genetic algorithmsMADDALA, Jeevan; RENGASWAMY, Raghunathan.Computers & chemical engineering. 2014, Vol 60, pp 413-425, issn 0098-1354, 13 p.Article

Development of CMOS-MEMS in-plane magnetic coils for application as a three-axis resonant magnetic sensorCHANG, Chun-I; TSAI, Ming-Han; SUN, Chih-Ming et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 3, issn 0960-1317, 035016.1-035016.14Article

Development of Capacitive-Type MEMS Microphone with CMOS Amplifying ChipYOUNG HWA LEE; YOUNGDO JUNG; KWAK, Jun-Hyuk et al.International journal of precision engineering and manufacturing. 2014, Vol 15, Num 7, pp 1423-1427, 5 p.Article

Development of UV-assisted ozone steam etching and investigation of its usability for SU-8 removalYOSHIDA, Shinya; ESASHI, Masayoshi; TANAKA, Shuji et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 3, issn 0960-1317, 035007.1-035007.9Article

Displacement Sensing With Silicon Flexures in MEMS NanopositionersBAZAEI, Ali; MAROUFI, Mohammad; MOHAMMADI, Ali et al.Journal of microelectromechanical systems. 2014, Vol 23, Num 3, pp 502-504, issn 1057-7157, 3 p.Article

Epitaxial Growth and Characterization of Self-Doping Si_1-xGe_x/Si Multi-Quantum Well MaterialsBO JIANG; TAO DONG; YAN SU et al.Journal of microelectromechanical systems. 2014, Vol 23, Num 1, pp 213-219, issn 1057-7157, 7 p.Article

Fabrication of a MEMS capacitive accelerometer with symmetrical double-sided serpentine beam-mass structureXIAOFENG ZHOU; LUFENG CHE; YOULING LIN et al.Microsystem technologies. 2014, Vol 20, Num 7, pp 1365-1372, issn 0946-7076, 8 p.Article

Fabrication of fiber-optic broadband ultrasound emitters by micro-opto-mechanical technologyBELSITO, L; VANNACCI, E; MANCARELLA, F et al.Journal of micromechanics and microengineering (Print). 2014, Vol 24, Num 8, issn 0960-1317, 085003.1-085003.11Article