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Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applicationsFABBRI, G; SARTORI, C; SCARANO, G et al.The International journal of microcircuits and electronic packaging. 2001, Vol 24, Num 4, pp 405-420, issn 1063-1674Article

Nuisances d'origine électrostatique dans l'industrie, Fontenay-aux-roses, 24-25 octobre 1989Nuisances d'origine électrostatique dans l'industrie. Séminaire. 1989, 191 p., isbn 2-9504182-0-1Conference Proceedings

Prospectives technologiques japonaises : électronique, informatique, télécommunication = Japanese technological prospective : electronics, computer science, telecommunicationGROUT, François.1988, 62 p.Report

DAC : 26th ACM/IEEE design automation conference, June 25-29, 1989, Las Vegas NVProceedings - ACM IEEE Design Automation Conference. 1989, issn 0738-100X, isbn 0-89791-310-8, XXVI-839 p, isbn 0-89791-310-8Conference Proceedings

1989 international conference on consumer electronics. IIIEEE transactions on consumer electronics. 1989, Vol 35, Num 4, issn 0098-3063, 715-929 [215 p.]Conference Proceedings

The 15th conference of electrical and electronics engineers in Israel, April 7-9, 1987, Tel AvivConference of electrical and electronics engineers in Israel. 15. 1989, pagination multConference Proceedings

Selected technology summaries for microwave theory and techniques: 1988HORTON, J. B.IEEE transactions on microwave theory and techniques. 1989, Vol 37, Num 6, pp 1040-1053, issn 0018-9480Article

Proceedings/CAS Karuizawa Workshop, May 12, 1987, JPNTransactions of the Institute of electronics, information and communication engineers. 1988, Vol 71, Num 12, pp 1176-1252, issn 0913-574XConference Proceedings

Télécommandes industrielles: niveau de sécuritéDEI SVALDI, D; PAGLIERO, D.Les Cahiers de notes documentaires - Institut national de sécurité. 1989, Num 136, pp 477-495, issn 0007-9952Article

Note d'information du service scientifique au Japon: secteur électronique = Information note of the scientific service in Japan: electronic section1988, 25 p.Report

A SPICE Model of Resistive Random Access Memory for Large-Scale Memory Array SimulationHAITONG LI; PENG HUANG; BIN GAO et al.IEEE electron device letters. 2014, Vol 35, Num 2, pp 211-213, issn 0741-3106, 3 p.Article

Miniaturized 180° Hybrid Coupler in LTCC for L-Band ApplicationsBRZEZINA, Greg; ROY, Langis.IEEE microwave and wireless components letters. 2014, Vol 24, Num 5, pp 336-338, issn 1531-1309, 3 p.Article

Tunnel FET technology: A reliability perspectiveDATTA, Suman; HUICHU LIU; NARAYANAN, Vijaykrishnan et al.Microelectronics and reliability. 2014, Vol 54, Num 5, pp 861-874, issn 0026-2714, 14 p.Article

Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issuesTANAKA, Shuji.Microelectronics and reliability. 2014, Vol 54, Num 5, pp 875-881, issn 0026-2714, 7 p.Article

Influence of surface states on the reverse and noise properties of silicon power diodesPAPEZ, Václav; HAJEK, Jiří; KOJECKY, Bedřich et al.IET circuits, devices & systems (Print). 2014, Vol 8, Num 3, pp 213-220, issn 1751-858X, 8 p.Article

Chip-Package Interaction in 3D stacked IC packages using Finite Element ModellingVANDEVELDE, Bart; IVANKOVIC, A; BEYNE, E et al.Microelectronics and reliability. 2014, Vol 54, Num 6-7, pp 1200-1205, issn 0026-2714, 6 p.Conference Paper

Risk and reliability assessment about a manufacturing issue in a power MOSFET for automotive applicationsBERGES, C; SOUFFLET, P; JADRANI, A et al.Microelectronics and reliability. 2014, Vol 54, Num 9-10, pp 1887-1890, issn 0026-2714, 4 p.Conference Paper

A FET Structure Field Emission Device With High-Speed Pulse Signal ControlLIU XIANG; LI CHI; LEI WEI et al.IEEE electron device letters. 2013, Vol 34, Num 4, pp 550-552, issn 0741-3106, 3 p.Article

A new compensation pixel circuit with all-p-type TFTs for AMOLED displaysYAO, Ri-Hui; ZHANG, Li-Rong; LEI ZHOU et al.Displays. 2013, Vol 34, Num 3, pp 187-191, issn 0141-9382, 5 p.Article

Design and simulation of hybrid CMOS―SET circuitsJANA, Anindya; BASANTA SINGH, N; SING, J. K et al.Microelectronics and reliability. 2013, Vol 53, Num 4, pp 592-599, issn 0026-2714, 8 p.Article

Hybrid Inorganic/organic complementary circuits using PEALD ZnO and ink-jet printed diF-TESADT TFTsLI, Yuanyuan V; MOUREY, Devin A; LOTH, Marsha A et al.Organic electronics (Print). 2013, Vol 14, Num 10, pp 2411-2417, issn 1566-1199, 7 p.Article

Parameter Extraction and Comparison of Self-Heating Models for Power MOSFETs Based on Transient Current Measurements : ADVANCED MODELING OF POWER DEVICES AND THEIR APPLICATIONSKOH, Risho; IIZUKA, Takahiro.I.E.E.E. transactions on electron devices. 2013, Vol 60, Num 2, pp 708-713, issn 0018-9383, 6 p.Article

Printed Half-Wave and Full-Wave Rectifier Circuits Based on Organic DiodesHELJO, Petri S; MIAO LI; LILJA, Kaisa E et al.I.E.E.E. transactions on electron devices. 2013, Vol 60, Num 2, pp 870-874, issn 0018-9383, 5 p.Article

SPICE-Based Performance Analysis of Trigate Silicon Nanowire CMOS CircuitsTANAKA, Chika; SAITOH, Masumi; OTA, Kensuke et al.I.E.E.E. transactions on electron devices. 2013, Vol 60, Num 4, pp 1451-1456, issn 0018-9383, 6 p.Article

Wafer-Level Integration of High-Quality Bulk Piezoelectric Ceramics on SiliconETHEM ERKAN AKTAKKA; PETERSON, Rebecca L; NAJAFI, Khalil et al.I.E.E.E. transactions on electron devices. 2013, Vol 60, Num 6, pp 2022-2030, issn 0018-9383, 9 p.Article

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